SR10-X3A
- MIL-STD-810 Anti-Vibration, Shock
- Intel 8th Coffee-Lake (H) Core i7-8850H (2.6 GHz, up to 4.3 GHz)
- DDR4-32GB
- Multi display : DisplayPort, HDMI & VGA
- Storage (1) : M.2 for Boot Up
- Storage (2) : 1x 2.5” SATA SSD
- 2x LAN, 4x USB3.1
- 9V~36V DC-DC
- Extended temperature -40°C to 60°C
- Technical Profile
- Specifications
- Introduction
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SR10-X3A — A system born to succeed in mission critical projects and harsh environment provides a multi-layer backup plan encompassing data redundancy and power protection that are highly valued by demanding Global Tier 1 companies. It’s driven by Intel 8th Gen Coffee Lake H i7-8850H (6C, 2.6/4.3GHz) and can enlarge its capacity of storages in such a compact size by leveraging dual storage design (1 x mSATA, 1 x 2.5" swappable SATAIII SSD). Further more, SR10-X3A merges three kinds of video outputs: DisplayPort, HDMI and VGA, transforming itself into a perfect choice for multi-screen utilization.
- Purpose-Built System For Agile Reconnaissance
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SR10-X3A offers an extension to Frame grabbers which is extremely vital in applications related to agile reconnaissance, e.g., target acquisition, smart surveillance, and security. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to user and command control center. By adding a slim frame grabber card, SR10-X3A can collect useful images and help our clients to react promptly in the ever-changing world.
1. Intel 8th Gen Coffee Lake H processor
As a member of Coffee Lake H, i7-8850H is a Hexa-Core processor supporting Max Turbo Frequency up to 4.3GHz. When paired with an Intel QM370 chipset, i7-8850H offers enhanced CPU/graphics performance and security feature Intel Software Guard eXtensions (SGX) over previous generation and introduce native USB 3.1. What’s more, i7-8850H takes the reliability of SR10-X3A to a higher level based on BGA 1440 packaging, yet it provides TDP option of 45W giving excellent balance of performance and power suited for space-constrained designs, embedded use conditions & excellent longevity.
2. Flexible display output & triple display
The various display output ports of SR10-X3A supports 1 x DisplayPort, 1 x HDMI, and 1 x VGA with Full HD 1080P resolution display. The system can not only provide the single desktop display but also allow triple screens display. The high flexible display output can accept diverse applications and provide the best display performance.
The integrated UHD Graphics supports three independent displays with 4k resolution each, and comes with hardware-based video encoding and decoding up to 4k. It features HDMI and DisplayPort outputs to provide advanced solutions for imaging, machine vision, infotainment, medical and gaming machines.
3. MIL-STD-810
7Starlake's computers are designed to meet the strict standards of MIL-STD-810. When it comes to true ruggedness, MIL-STD-810 standard is considered the upmost principle. Originally established by the US government to simulate how materials would hold up to harsh environments, It provides a series of testing procedures for resistance to shock, vibration, extreme temperatures…etc.
- Vibration
Vibration test is conducted to create an environment, in which long-term and high level vibration is simulated. The test is performed with both the system operating/non. Various levels and duration of vibration is simulated with up to 7g transitions in X & Y axis, and 5Grms in Z axis.
- Shock
Mechanical Shock test is conducted to ensure that equipment can withstand drops encountered during handling, transportation, and normal use. The test is performed with both the system operating/non. We expose the system to 3 pulses/direction of sawtooth shock at 40g 11ms. 6 directions for a total of 18 pulses.
- I/O
Operating Temp. |
|
---|---|
-40°C to 60°C ( ambient with air flow ) | |
System |
|
Model | SR10-X3A |
CPU | Intel® 8th Gen Core™ i7-8850H (2.6Ghz, Up to 4.3Ghz) |
Chipset | QM370 |
Memory | Up to 32GB DDR4 RAM |
Display |
|
GPU | Intel® UHD Graphics 630 |
Display Port | Resolution up to 4096x2304@60Hz |
HDMI | Resolution up to 4096×2160@30Hz |
DVI-D | Resolution up to 1920x1200 @ 60Hz |
Storage |
|
Storage Device | 1x 2.5" SATA 3.0 SSD 1x mSATA |
Ethernet |
|
2x Intel Gigabit Ethernet LAN Interfaces (10/100/1000 Mbps) | |
Rear I/O |
|
DisplayPort | 1x 20Pin DisplayPort connector (Female) |
HDMI | 1x 19Pin HDMI connector (Female) |
Ethernet | 2x RJ45 Gigabit Ethernet LAN Interfaces |
USB Port | 4x USB3.1 Gen2 standard-A connectors |
VGA Port | 1x VGA |
Audio Port | 1x Line-Out, 1x MIC-In connector |
DC-IN | 1x 4P Rugged Terminal connector |
Front I/O |
|
Button | 1x Power Button w/Indicator LED |
Indicator LED | 1x HDD LED |
USB Port | 2x USB2.0 -- By Options |
Serial Port | 2x RS232/422/485 (By Options) |
Applications, Operating System |
|
Applications | Industrial and Military Platforms Requiring Compliance to MIL-STD-810 Unmanned Platform, Robotic, Smart Surveillance applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions. |
Operating System | Windows 10 64 bit Ubuntu 16.04, Ubuntu 14.04, Fedora 28 |
Physical |
|
Dimension (WxDxH) | 308 x 149 x 65.2 mm |
Weight | 3.21 Kg |
Chassis | Aluminum Alloy, Corrosion Resistant. |
Finish | Anodic aluminum oxide (Color Iron gray) |
Cooling | Natural Passive Convection/Conduction. No Moving Parts |
Connectors | DC-IN : PHOENIX CONTACT 1776715 RJ45 Ethernet : RTB-19GB9J1A COM: FEN YING SM10-09P HDMI + DP : JKCR Display and HDMI Female |
Ingress Protection | Dust Proof (Similar to IP50) |
Environmental |
|
MIL-STD-810 | Method 507.5, Procedure II (Temperature ® Humidity) Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6 Shock-Procedure I Operating (Mechanical Shock) Method 514.6 Vibration Category 24/Non-Operating (Category 20 ® 24, Vibration) Method 514.6 Vibration Category 20/Operating (Category 20 ® 24, Vibration) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
Operating Temperature | -20°C to 60°C (ambient with 0.7m/s airflow) |
Storage Temperature | -40°C to 85°C |
EMC | CE and FCC compliance |