SCH-3X1
IEC-61850-3 , IEEE-1613 Substation Fanless Computer, with Intel® Core™ 9th Gen. Coffeelake-R i7-9700TE Processor, Operating Temperature -20°C to 60°C
- Intel® Core™ i7-9700TE
- 2 x DDR4 2666MHz, SO-DIMM up to 64GB
- 2 x 2.5”Easy swap SSD Tray
- 2 x PCIe expansion slot (PCIe Gen3.0 x 8)
- 2 x RJ45 LAN
- 6 x USB3.0, 2 x USB2.0, 1 x DP , 1 x DVI-I , 1 x HDMI
- 2 x RS232 / 422 / 485 (Support Power 5V / 12V)
- Operation Temperture : -20°C to 60°C
- Technical Profile
- Specifications
- CPU
- Order Information
- Download
Gateways are rugged communication devices collecting numerous data, such as metering, status, events and fault report from any protection device while sending this information upstream to a control center, transfering commands issued from the control center to other devices. One example of a particular need for gateways is in the energy industry. The energy industry requires specific types of devices using specific protocols. With PLCs/PACs becoming popular in these applications, gateways has grown into a necessary part of Substation Automation Systems, and its reliability may affect the safety of whole system at a station level.
As a leading company specialized in energy related application, 7Starlake’s experienced team designed an extremely reliable Gateway system SCH-3X1. Powered by Intel 9th Gen. Core i7-9700TE processor, SCH-3X1 owns highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as 2 x LAN port and 2 x COM, SCH-3X1 is an undoubtedly best choice for Gateway application in Substation.
(1)Security Redundancy
Integrating TPM module, operating systems can require an authentication to protect keys, data or systems.
(2)Network Redundancy
PRP/HSR network is an efficient and cost effective solution to construct a seamless/bumpless communication infrastructure.
(3)Rich communication Interface
In advantage of SCH-3X1’s diverse I/O, 2 x COM (All support RS232/422/485), 6 x USB3.0, 2 x LAN, the SCH-3X1 system can meet all clients’ communication requirement.
(4)IEC-61850-3
IEC 61850 defines the communication protocols for intelligent electronic devices at electric substations. IEC-61850-3 defines the complete testing requirement for the equipment which conforms to the standard.
(5)IEEE-1613
Detail environment and testing requirements for communications networking devices in electric power substations.
(6)Extreme Operating Temperature
Ensure high reliability and stability while operating under a harsh environment such as temperature from -20°C up to 60°C
(7)Ultra Wide Voltage Support
9V-48V, a very wide range voltage of DC-input capability, allows users to adopt all kinds of working site and applications scenario.
- Why IEC-61850 Is Necessary
-
Although there are lots of protocols worldwide for substation automation, IEC-61850 is the only one that supports systems networked together to perform intelligent transmission and distribution protection, monitoring, automation, metering, and control. The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED).
- Substation Main Features
System |
|
|---|---|
| CPU | Intel® 9th Core™ i7-9700TE, 8C, 1.8/2.8GHz, 12MB cache, TDP 35W |
| Chipset | Intel®C246 |
| Memory Type | DDR4-2666MHz, 2 x 260-pin SO-DIMM, Max 64GB |
| Expansion Slot | 2 x PCIe 3.0 x 8 |
| Storage Device | 2 x 2.5”Easy swap SSD Tray |
Front I/O |
|
| Power Button | 1 x Power Button w/Indicator LED |
| LED | 1 x PWR LED ; 1 x HDD LDD |
| HDMI | 1 x HDMI 1.4 |
| USB | 2 x USB3.0 |
| Rear I/O | |
| COM | 2 x RS232/422/485 (Support Power 5V/12V) |
| Ethernet | 2 x RJ45 |
| USB | 4 x USB3.0, 2 x USB2.0 |
| PS/2 | 1 |
| SidplayPort | 1 x DP1.2 |
| DVI-I | 1 x DVI-I |
| Terminal Block |
1 x 2Pin Terminal Block Remote Power ON/OFF 1 x 2Pin Terminal Block Remote Reset 1 x 4Pin Terminal Block External FAN connector 1 x 3Pin Terminal Block Power input |
| Audio | 1 x Mic-in, 1 x Line-out |
| DC-IN | 1 x 9~48V |
Mechanical and Environment |
|
| Dimension( W x D x H ) | 170 x 264 x 250 mm |
| System Design | Fanless |
| Mounting | Rackmount Cube |
| Operating Temp. | -20°C to 60°C(35W CPU) |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non-condensing |
| OS support list | |
| Windows | Windows 10 64 Bit |
| Linux | Ubuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2(By Request) |
| Certification | |
| EMC | CE . FCC Certification |
| Green Product | RoHS, WEEE compliance |
Intel® Core™ i7-9700TE Processor (up to 3.8 GHz, 8 cores)
Thermal Point \ Testing Temp. |
-40°C |
-20°C |
0°C |
+25°C |
+50°C |
+55°C |
+60°C |
|---|---|---|---|---|---|---|---|
|
CPU T-J |
16 |
58 |
68 |
75 |
91 |
||
|
CPU Die |
11.8 |
38.6 |
71.9 |
76 |
81.5 |
||
|
CPU Heat sink |
8.2 |
34.7 |
67.8 |
72 |
77.3 |
||
|
Δ1=(TJ-Die) |
4.7 |
5.0 |
5.0 |
7.0 |
7.0 |
||
|
Δ2=(Die-Heat Sink) |
4.7 |
5.0 |
5.0 |
6.0 |
5.0 |
||
|
CPU Frequency (GHz) |
3.15 | 3.02 |
3.02 |
2.68 |
2.57 |
2.45 |
2.41 |
Intel® Core™ i7-8700T Processor (up to 2.4 GHz, 6 cores)
Thermal Point \ Testing Temp. |
-40°C |
-20°C |
0°C |
+25°C |
+50°C |
+55°C |
+60°C |
|---|---|---|---|---|---|---|---|
|
CPU T-J |
16 |
77 |
95 |
99 |
100 |
||
|
CPU Die |
11.8 |
38.6 |
71.9 |
76 |
81.5 |
||
|
CPU Heat sink |
8.2 |
34.7 |
67.8 |
72 |
77.3 |
||
|
Δ1=(TJ-Die) |
4.7 |
5.0 |
5.0 |
7.0 |
7.0 |
||
|
Δ2=(Die-Heat Sink) |
4.7 |
5.0 |
5.0 |
6.0 |
5.0 |
||
|
CPU Frequency (GHz) |
2.83 | 2.85 |
2.66 |
2.97 |
2.26 |
2.18 |
2.19 |
Intel®i7-8700 Processor( up to 3.2 GHz,6 cores)
Test 50°C with air flow
|
Description |
System Top Sink |
CPU Die |
CPU T-j |
CPU Freq |
|---|---|---|---|---|
|
100%CPU Loading 50°C with hot air flow |
71.4 |
68.8 |
100 |
3.1 GHz |
|
100%CPU Loading 50°C with hot air flow |
70.4 |
73.2 |
100 |
3.2 GHz |
Test 60°C with air flow
|
Description |
System Top Sink |
CPU Die |
CPU T-j |
CPU Freq |
|---|---|---|---|---|
|
100% CPU Loading 60°C with hot air flow |
76.8 |
81.5 |
100 |
2.99 GHz |
|
100% CPU Loading 60°C with hot air flow |
75 |
79.6 |
100 |
3.15 GHz |
Test 50°C with no air flow
|
Description |
System Top Sink |
CPU Die |
CPU T-j |
CPU Freq |
|---|---|---|---|---|
|
100% CPU Loading 50°C without air flow |
78 |
81.1 |
100 |
3.05 GHz |
|
100% CPU Loading 50°C without air flow |
77 |
81.1 |
100 |
3.06 GHz |
SCH-3X1
IEC-61850-3 , IEEE-1613 Substation Fanless Computer with Intel® Core™ i7-9700TE, 2 x 2.5” Easy swap SSD Tray, 2 x PCIe expansion slot, 2 x RJ45 LAN , 6 x USB 3.0 , 2 x USB 2.0 , 1 x PS/2, 1 x DP , 1x DVI,1 x HDMI , 2 x COM(RS232/422/485), 1 x Mic-in / 1 x Line-out, 9~48V DC-IN, 2Extend Temp -20 to 60°C
| Attachment | Size |
|---|---|
| SCH3X1_IEC61850_TEST REPORT - 0916.pdf (1.83 MB) | 1.83 MB |
| T210708D08-D (SCH-3X1) FCC Part 15 B.pdf (810.86 KB) | 810.86 KB |
| T210708D08-E (SCH-3X1) EN 55032&35.pdf (2.23 MB) | 2.23 MB |
| Verification - CE.pdf (147.62 KB) | 147.62 KB |
| Verification - FCC.pdf (146.95 KB) | 146.95 KB |
| SCH300_Vibration_Shock_Test_Report.pdf (1.58 MB) | 1.58 MB |
| SCH3X1.pdf (641.67 KB) | 641.67 KB |