7SL-3500-CC

7SL-3500 3U-VPX

The 7SL-3500-CC 3U VPX System is a modular Military Rugged ATR enclosure, geared for 3U OpenVPX designs. The versatile design allows multiple customizable configurations based on proven components and design techniques. 7SL-3500-CC Hybrid conduction cooled plate assisted by forced air sets with aggregate power demands over 300W. 

Custom and standard 3 slot backplanes with VPX and SOSA aligned slot profiles in combinations supporting high speed signal processing applications.
Scalable to multi CPU-GPU requirements

Designed expressly for Gen 4.0 ultra-high wattage military systems

Conduction Cooled_7SL-3500CC2

• As the most common heat-transfer device available, heat pipes can manage the transfer of heat between two solid interfaces effectively. Combining the advantages of thermal-conductivity and phase transition, heat pipes are extremely light-weight compared with traditional cooling methods.,
• For the highest thermal dissipation and thermal density, heat pipes can be very effective in conduction cooled environments.
• The heat pipes are embedded in a symmetrical topology from the sidewall, allowing the assembly to be less sensible to gravity or acceleration
• This technique, not only improves thermal performance, but also helps to sustain a high level of shock and vibration by providing a rigid frame to attach the board at multiple points.