ROC288AA
1U 19” DC-DC Redundant Fanless Server With Intel 14th/13th Processor
- Intel® Raptor Lake -S/R 14th/13th Gen Processor (Up to 65W)
- PCH Q670E/R680E
- 2 x SO-DIMM DDR5 5200 MHz up to 64GB
- 3 x LAN, 6 x USB3.1 , 2 x USB2.0, 2 x DisplayPort, 2 x HDMI, 1 x Line-out/Mic-in
- 2 x 2.5”SATA HDD/SSD Easy Swap Tray
- DC-IN 16~31V w/Redundant
- Operation Temp. ET: -20°C to +60°C ; UT : -30°C to +70°C
- Technical Profile
- Specifications
- Order Information
- Thermal Solution
- Introduction
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The ROC288AA is a rugged industrial 1U 19” fanless server built on the Intel® Q670E/R680E Chipset. It delivers essential system functions, including high-performance connectivity, modern manageability, and advanced security technologies. Powered by Intel® Raptor Lake-R/S 13th/14th Gen processors (up to 65W), the ROC288AA supports DDR5 memory up to 64GB and offers versatile connectivity: 2 x DisplayPort, 2 x HDMI, 3 x 2.5GbE RJ45, 6 x USB 3.1 (10Gb/s), 2 x USB 2.0, and 2 x 2.5” SATA HDD/SSD easy-swap trays. It also includes dual 3.5mm audio jacks (Mic-in, Line-out) and a 16–31V AC input power supply with redundancy. Built for reliability in harsh environments, the ROC288AA supports extended temperatures from -30°C to 70°C, making it ideal for industrial, commercial, and mission-critical applications.
- Intel® Raptor Lake-Refresh/ Raptor Lake-S processors
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Powered by a fully upgraded hybrid performance architecture—combining performance and efficiency cores—the ROC288AA leverages the new LGA1700 socket and chipsets to deliver intelligently allocated computing power. With high core counts, optimized graphics performance for machine vision, and enhanced AI inference, it brings advanced AI computing capability directly to the edge.
Meanwhile, the ROC288AA offers practical features such as an HDD/SSD easy‑swap tray and multiple expansion slots, making it a reliable server solution for commercial and industrial platforms. From process control to intelligent automation and manufacturing applications, it provides the durability and flexibility needed to meet demanding workloads.
- I/O Placement
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System |
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| High Performance Processor | 14th/13th Gen Intel® Raptor Lake-R/Raptor Lake-S LGA1700 Socket Processor / Core™ i9/i7/i5/i3 Processor /TDP 65W | |
| Memory type | DDR5 5200 MHz /2 x 262-pin SO-DIMM / Max. 64 GB (Non-ECC/ECC) | |
| Chipset | Intel® Q670E/R680E Chipset | |
| Expansion | 1 x PCIe expansion slot (PCIe x16 HHHL) | |
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Storage |
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| HDD/SDD | 2 x 2.5” Solid State Disk (SSD) | |
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Ethernet |
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| Ethernet | Intel® I226-LM 2.5GbE LAN, Intel® I226-V 2.5Giga LAN | |
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Front I/O |
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| DisplayPort | 2 x DP | |
| HDMI | 2 x HDMI | |
| Ethernet | 3 x 2.5GbE RJ45 | |
| Audio | 1x MIC, 1x Line-Out | |
| USB Port | 6 x USB 3.1(10Gb/s) | |
| PCIe expansion | 1 x PCIe expansion slot (PCIe x16 HHHL) | |
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AC-IN |
2 x DC-IN plug |
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Rear I/O |
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Easy Swap SSD Tray |
2 |
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Button |
1 x Power Button w/Indicator LED |
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Indicator LED |
SSD |
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| Power Requirement | ||
| Power Input | DC-IN 16~31V w/Redundant | |
| Applications, Operating System | ||
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Applications |
Commercial and Industrial Platforms, Embedded Computing, Process Control, Intelligent Automation and manufacturing applications |
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Operating System |
Windows 10/11 64Bit |
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Physical |
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Dimensions |
430 x 400 x 44.4 mm (W x D x H) |
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Weight |
6 kg |
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Chassis |
SECC |
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Heatsink |
Aluminum Alloy, Corrosion Resistant |
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Finish |
Anodic aluminum oxide |
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Environmental |
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Green Product |
RoHS design to meet |
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| Operating Temperature | ET: -20 to +60°C UT: -30 to +70°C |
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Storage Temperature |
-40 to +85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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EMC |
CE and FCC designed to meet |
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ROC288AA-ET
1U 19” DC-DC Fanless System withIntel® Raptor Lake-R/S 14th/13th Processor(Up to 65W), Q670E/R680E, 2 x DDR5 SO-DIMM up to 64GB, 2 x DisplayPort, 2 x HDMI,6 x USB, 2 x USB2.0, 16~31V AC-IN w/Redundant support, Operating Temp. -20~+60°C
ROC288AA-UT
1U 19” DC-DC Fanless System withIntel® Raptor Lake-R/S 14th/13th Processor(Up to 65W), Q670E/R680E, 2 x DDR5 SO-DIMM up to 64GB, 2 x DisplayPort, 2 x HDMI,6 x USB, 2 x USB2.0, 16~31V AC-IN w/Redundant support, Operating Temp. -30~+70°C
- Dual side thermal solution, fanless design for 1U slim size
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With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.
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