ROC288BB
1U 19” AC-DC Redundant Fanless Server With Intel 14th/13th Processor
- Intel® Raptor Lake -S/R 14th/13th Gen Processor (Up to 65W)
- PCH Q670E/R680E
- 2 x SO-DIMM DDR5 5200 MHz up to 64GB
- 3 x LAN, 6 x USB3.1 , 2 x USB2.0, 2 x DisplayPort, 2 x HDMI, 1 x Line-out/Mic-in
- 2 x 2.5”SATA HDD/SSD Easy Swap Tray
- AC-IN 100~240V with redundant
- Operation Temp. ET: -20°C~60°C ; UT: -30°C~70°C
- Technical Profile
- Specifications
- Order Information
- Thermal Solution
- Introduction
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The ROC288BB is an industrial 1U 19” fanless server based on Intel® Q670E/R680E Chipset, an essential companion to Intel’s new performance hybrid processors, providing I/O and other system-critical functions to computing devices such as high performance connectivity, modern manageability, and security technologies. The ROC288BB, powered by Intel® Raptor Lake-S/R 14th /13th Gen Processor(up to 65W) supports DDR5 up to 64GB, 2 x DP, 2 x HDMI, 3 x RJ45 (3 x 2.5GbE), 2 x 3.5mm Audio Jacks (1 x Mic-in, 1 x Line-out), 6 x USB 3.1 (10Gb/s), 2 x USB2.0, 2 x 2.5” SATA HDD/ SSD Easy Swap Tray, 90-260V AC-IN Power Supply with Redundant, extended temperature -30°C~70°C.
- Intel® Raptor Lake-Refresh/ Raptor Lake-S processors
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Through fully-upgraded hybrid performance architecture (configuration of a mix of performance and efficiency cores) new socket LGA1700 and chipsets, the ROC288BB features the intelligently allocation of high computing power created by high core counts, efficiency optimization for graphic performance &machine vision, and AI inference enhancement to bring AI computing capability to the edge.
Featuring advantages such as an HDD/SSD easy-swap tray and multiple expansion slots, the ROC288BB is a reliable server solution designed to meet the demands of commercial and industrial platforms, process control, intelligent automation, and manufacturing applications.
- I/O Placement
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| System | ||
|---|---|---|
|
High Performance Processor |
14th/13th Gen Intel® Raptor Lake-R/Raptor Lake-S LGA1700 Socket Processor / Core i9/i7/i5/i3 Processor / TDP 65W |
|
|
Memory type |
DDR5 5200 MHz / 2 x 262-pin SO-DIMM / Max. 64 GB (Non-ECC/ECC) |
|
|
Chipset |
Intel® Q670E/R680E Chipset |
|
| Expansion | 1 x PCIe expansion slot (PCIe x 16 HHHL) | |
| Display | ||
| DP | Resolution up to 4096 x 2304 @60Hz | |
| HDMI | Resolution up to 4096 x 2304 @60Hz | |
| Storage | ||
|
HDD/SDD |
2 x 2.5” Solid State Disk (SSD) |
|
| Ethernet | ||
|
Ethernet |
Intel® I226-LM 2.5Giga LAN Intel® I226-V 2.5Giga LAN |
|
| Front I/O | ||
| Easy Swap SSD Tray | 2 | |
| Button | 1 x Power Button w/Indicator LED | |
| Indicator LED | SSD | |
| Rear I/O | ||
| DisplayPort | 2 x DP | |
| HDMI | 2 x HDMI | |
| Ethernet | 3 x 2.5GbE RJ45 | |
| Audio | 1x MIC, 1x Line-Out | |
| USB Port | 6 x USB 3.1(10Gb/s) | |
| PCIe expansion | 1 x PCIe expansion slot (PCIe x 16 HHHL) | |
| AC-IN | 2 x AC-IN plug | |
| Power Requirement | ||
| Power Input | AC-IN 100~240V w/Redundant | |
| Applications, Operating System | ||
|
Applications |
Commercial and Industrial Platforms, Embedded Computing, Process Control, Intelligent Automation and manufacturing applications |
|
| Operating System | Windows 10/11 64Bit Linux (support by request) |
|
| Physical | ||
|
Dimension (W x D x H) |
430 x400 x 44.4 mm |
|
|
Chassis |
SECC |
|
|
Heatsink |
Aluminum Alloy, Corrosion Resistant |
|
|
Finish |
Anodic aluminum oxide |
|
| Environmental | ||
|
Green Product |
RoHS design to meet |
|
| Operating Temperature | ET : -20 to 60°C UT : -30 to 70°C |
|
|
Storage Temperature |
-40 to 85°C |
|
|
Relative Humidity |
5% to 95%, non-condensing |
|
|
EMC |
CE and FCC design |
|
ROC288BB-ET
1U 19” AC-DC Fanless System withIntel® Raptor Lake-R/S 14th/13th Processor(Up to 65W), Q670E/R680E, 2 x DDR5 SO-DIMM up to 64GB, 2 x DisplayPort, 2 x HDMI,6 x USB, 2 x USB2.0, 100~240V AC-IN w/ Redundant support, Operating Temp. -20~+60°C
ROC288BB-UT
1U 19” AC-DC Fanless System withIntel® Raptor Lake-R/S 14th/13th Processor(Up to 65W), Q670E/R680E, 2 x DDR5 SO-DIMM up to 64GB, 2 x DisplayPort, 2 x HDMI,6 x USB, 2 x USB2.0, 100~240V AC-IN w/Redundant support, Operating Temp. -30~+70°C
- Dual side thermal solution, fanless design for 1U slim size
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With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.
