ROC288BB
1U 19” AC-DC Redundant Fanless Server With Intel Raptor Lake-S Processor
- Intel® Raptor Lake -S13th Gen Processor
- PCH Q670
- 2 x SO-DIMM DDR5 4800 MHz up to 64GB
- 1 x M.2 2242/2280 M-Key(PCIe3.0 x4 / STATIII)
1 x M.2 2230 E-Key(PCIe x 1 / USB2.0)
1 x M.2 3042 B-Key(PCIe x 1 / USB2.0. SATAIII)
- 4 x USB3.1 , 2 x USB2.0, 1 x DisplayPort, 1 x HDMI, 2 x LAN, 1 x Line-out/Mic-in
- 2 x 2.5”SATA HDD/SSD Easy Swap Tray
- AC-IN 90~260V with redundant
- Operation Temp. ET : -20 ~ 60°C ; UT : -30 ~ 70°C
- Technical Profile
- Specifications
- Order Information
- Thermal Solution
Introduction
ROC288BB is an industrial 1U 19” fanless server based on Intel® Q670 Chipset, an essential companion to Intel’s new performance hybrid processors, providing I/O and other system-critical functions to computing devices such as high performance connectivity, modern manageability, and security technologies. ROC288BB, powered by Intel® Raptor / Alder Lake-S13th /12th Gen Processor(up to 65W) supports DDR5 up to 64GB,1x M.2 2230 E key/ 1x M.2 3042 B key/ 1x M.2 2242 / 2280 M key,1 x DP, 1 x HDMI, 2 x RJ45(1 x GbE ; 1 x 2.5GbE), 2 x 3.5mm Audio Jacks (1 x Mic-in, 1 x Line-out), x USB 3.1(10Gb/s),2 x 2.5” SATA HDD/ SSD Easy Swap Tray,90-260V AC-IN Power Supply with Redundant, extented temperature -30 ~ 70°C.
- Intel® Raptor Lake-S/ Alder Lake-S processors
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Through fully-upgraded hybrid performance architecture (configuration of a mix of performance and efficiency cores) new socket LGA1700 and chipsets, ROC288BB features the intelligently allocation of high computing power created by high core counts, efficiency optimization for graphic performance &machine vision, and AI inference enhancement to bring AI computing capability to the edge.
With further advantages, for example, HDD/ SSD easy swap tray and multi-expansion slot, we believe that ROC286BB is a best choice for those, who are looking for an ideal server to meet the requirements of commercial and industrial platforms, process control, intelligent automation and manufacturing applications.
- I/O Placement
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System |
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High Performance Processor |
3th/12th Gen Intel® Raptor Lake-S/Alder Lake-S LGA1700 Socket Processor / Core i9/i7/i5/i3 Processor / TDP 65W |
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Memory type |
DDR5 4800 MHz / 2 x 262-pin SO-DIMM / Max. 64 GB (Non-ECC) |
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Chipset |
Intel® Q670 Chipset |
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Expansion Slot |
1x M.2 2230 E key (PCIe X1 , USB2.0, SMBus, CNVi) |
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Storage |
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HDD/SDD |
2x 2.5” SATA HDD/SSD easy swap tray |
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Ethernet |
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Ethernet |
Intel® I219-LM Giga LAN + Intel® I225V 2.5 Giga LAN |
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Front I/O |
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Display Port |
1 x DP |
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| HDMI | 1x HDMI | |
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Ethernet |
2x RJ45 (1 x GbE ; 1 x 2.5GbE) |
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Audio |
2x 3.5mm Audio Jacks (1x MIC, 1x Line-Out) |
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COM |
2x RS232/422/485 (422 / 485 select by BIOS) |
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USB Port |
4x USB 3.1(10Gb/s) |
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| PCIe expansion | 1 x PCIe expansion slot (Gen3 x 4 & low profile) | |
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AC-IN |
2x AC-IN, 90V~260V |
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Rear I/O |
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Easy Swap SSD Tray |
2 |
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Button |
1 x Power Button w/Indicator LED |
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Indicator LED |
SSD |
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| Applications, Operating System | ||
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Applications |
Commercial and Industrial Platforms, Embedded Computing, Process Control, Intelligent Automation and manufacturing applications |
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Operating System |
Windows 10/11 64Bit |
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Physical |
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Dimension (W x D x H) |
450 x430 x 44.4 mm |
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Weight |
6Kg |
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Chassis |
SECC |
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Heatsink |
Aluminum Alloy, Corrosion Resistant |
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Finish |
Anodic aluminum oxide |
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Environmental |
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Green Product |
RoHS compliance |
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| Operating Temperature | ET : -20 to 60°C UT : -30 to 70°C |
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Storage Temperature |
-40 to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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EMC |
CE and FCC compliance |
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ROC288BB-ET
19” 1U Rack-mount Rugged FanlessAC-DC Redundant System withIntel® Raptor/Alder Lake-S13th/12th Processor(Up to 65W), Q670, 2 x DDR5 SO-DIMM up to 64GB, 1 x DisplayPort, 1 x HDMI,4 x USB,90~260V AC-IN*2 Redundant support, Operating Temp. -20~+60°C
ROC288BB-UT
19” 1U Rack-mount Rugged FanlessAC-DC Redundant System withIntel® Raptor/Alder Lake-S13th/12th Processor(Up to 65W), Q670, 2 x DDR5 SO-DIMM up to 64GB, 1 x DisplayPort, 1 x HDMI,4 x USB,90~260V AC-IN*2 Redundant support, Operating Temp. -30~+70°C
- Dual side thermal solution, fanless design for 1U slim size
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With combination of high CPU computing power and graphic GPU performance generate numerous heat, 7STARLAKE emphasizes on providing exceeding thermal design guarantee system offers superior performance under critical environment. Based on our experience, ROC286 adopts dual side thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission, the aluminum heat sink dissipates the heat into surrounding air promptly. Both side thermal solution is mainly for processor. With unique thermal design, 7STARLAKE is capable to integrate high power consumption CPU into 1U such slim size fanless system.
