7SL-3500-LOC
3U VPX 3-slot, 1CPU 2GPU Liquid Cooled ATR
- 3U VPX 3 Payload Liquid Cooled ATR
- 3 Slot – 1CPU 2GPU
- Intel® i7-6820EQ (TDP 45W)
- Liquid Over Conduction (LOC)
- NVIDIA® Quadro® 5000 Ada (9728CUDA) or RTX™ A4500 (5888CUDA)
- 18V~36V DC Input
- MIL-STD 810 Vibration, Shock
- Custom Backplanes with VPX and SOSA-aligned Slot Profiles
- Custom I/O options including MIL-STD Wiring & Connectors
- Technical Profile
- Specifications
- Video
- Introduction
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7SL-3500-LOC
3U VPX Liquid Cooled ATR
The 7SL-3500-LOC Liquid-to-Liquid Cooled System is a modular, military-rugged ATR enclosure designed for 3U OpenVPX applications. Its flexible architecture supports a wide range of customizable configurations, leveraging proven components and field-tested design methodologies.
Featuring a hybrid conduction cold plate enhanced by liquid cooling, the system delivers an aggregate cooling capacity of up to 500W, ideal for high-performance, thermally demanding environments.
With custom and standard 3-slot backplanes, the 7SL-3500-LOC supports VPX and SOSA-aligned slot profiles, optimized for high-speed signal processing applications.
Advantages of Liquid-Cooled Technologies
Advanced Liquid to Liquid (LOC)
Advanced external Liquid to Liquid Solutions (LOC) provides several advantages for liquid-to-liquid heat transfer applications. These advantages focus on enhancing the efficiency and reliability of thermal management systems. Here are the key benefits of L2L solutions for liquid-to-liquid thermal exchange:
Efficient Heat Transfer
LOC designs and manufactures liquid-to-liquid heat exchangers, cooling systems, and components that optimize heat transfer efficiency. These systems use advanced materials, designs, and flow configurations to maximize the surface area for heat exchange, improving overall heat transfer performance.
Customization
LOC offers tailored solutions to meet the specific thermal needs of different industries, such as electronics cooling, power generation, and industrial processes. Their products can be customized for size, shape, and material to provide the best possible thermal solution for the application.
Compact Designs
Many LOC products are designed to be compact and lightweight while maintaining high performance. This is crucial for applications where space is limited, such as in high-density electronic systems or automotive applications.
Energy Efficiency
LOC's systems are designed to minimize energy consumption, which is essential for reducing operating costs and improving the overall sustainability of thermal management systems. Efficient heat transfer leads to lower energy usage for pumping liquids and maintaining temperature control.
Durability and Reliability
LOC focuses on producing highly durable and reliable components that can withstand challenging conditions. Their liquid-to-liquid heat exchangers and cooling systems are engineered to handle high pressures, temperatures, and corrosive environments, ensuring long-term performance without frequent maintenance.
Innovative Cooling Technologies
LOC incorporates cutting-edge cooling technologies, such as micro-channel heat exchangers and phase-change cooling systems, which allow for higher heat flux and more effective thermal management.
- 7SL-3500-LOC
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7SL-3500-LOC Liquid to Liquid
Liquid to Liquid
- 7SL-3500 Hybrid conduction cold plate assisted by Liquid cooling sets with aggregate power demands over 500W.
- A liquid-to-liquid cooling system cools below ambient temperature and offers similar temperature stability to a recirculating chiller. Instead of rejecting the waste heat to the room, it transfers it to chilled facility water via a liquid-to-liquid heat exchanger.
2 x NVIDIA RTX A4500, 16GB GDDR6, 5,888 CUDA
or 2x NVIDIA Quadro 5000 Ada GDDR6, 9,728 CUDA
- Appearance
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