7SL-3500-LOC
3U VPX 3-slot, 1CPU 2GPU Liquid Cooled ATR
- 3U VPX 3 Payload Liquid Cooled ATR
- 3 Slot – 1CPU 2GPU
- Intel i7-6820EQ (TDP 45W)
- Liquid Over Conduction(LOC)
- NVIDIA® Quadro® 5000 Ada (9728CUDA) or RTX™ A4500 (5888CUDA)
- 18V~36V DC Input
- MIL-STD 810 Vibration, Shock
- Custom backplanes with VPX and SOSA aligned slot profiles
- Custom I/O options including MIL-STD Wiring & Connectors
- Technical Profile
- Specifications
- Introduction
-
7SL-3500-LOC
3U-VPX Liquid Cooled
The 7SL-3500-LOC VPX Liquid 2 Liquid Cooled System is a modular Military Rugged ATR enclosure, geared for 3U OpenVPX designs.The versatile design allows multiple customizable configurations based on proven components and design techniques.
7SL-3500-LOC Hybrid conduction cold plate assisted by liquid cooling sets with aggregate power to 500W
Custom and standard 3 slot backplanes with VPX and SOSA aligned slot profiles in combinations supporting high speed signal processing applications.
Advantages of Liquid-Cooled Technologies
Advanced Liquid to Liquid (LOC)
Advanced external Liquid to Liquid Solutions (LOC) provides several advantages for liquid-to-liquid heat transfer applications. These advantages focus on enhancing the efficiency and reliability of thermal management systems. Here are the key benefits of L2L solutions for liquid-to-liquid thermal exchange:
Efficient Heat Transfer
LOC designs and manufactures liquid-to-liquid heat exchangers, cooling systems, and components that optimize heat transfer efficiency. These systems use advanced materials, designs, and flow configurations to maximize the surface area for heat exchange, improving overall heat transfer performance.
Customization
LOC offers tailored solutions to meet the specific thermal needs of different industries, such as electronics cooling, power generation, and industrial processes. Their products can be customized for size, shape, and material to provide the best possible thermal solution for the application.
Compact Designs:
Many LOC products are designed to be compact and lightweight while maintaining high performance. This is crucial for applications where space is limited, such as in high-density electronic systems or automotive applications.
Energy Efficiency
LOC's systems are designed to minimize energy consumption, which is essential for reducing operating costs and improving the overall sustainability of thermal management systems. Efficient heat transfer leads to lower energy usage for pumping liquids and maintaining temperature control.
Durability and Reliability
LOC focuses on producing highly durable and reliable components that can withstand challenging conditions. Their liquid-to-liquid heat exchangers and cooling systems are engineered to handle high pressures, temperatures, and corrosive environments, ensuring long-term performance without frequent maintenance.
Innovative Cooling Technologies
LOC incorporates cutting-edge cooling technologies, such as micro-channel heat exchangers and phase-change cooling systems, which allow for higher heat flux and more effective thermal management.
- 7SL-3500-LOC
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7SL-3500-LOC Liquid to Liquid
Liquid to Liquid
- 7SL-3500 Hybrid conduction cold plate assisted by Liquid cooling sets with aggregate power demands over 500W
- A liquid-to-liquid cooling system cools below ambient temperature and offers similar temperature stability to a recirculating chiller. Instead of rejecting the waste heat to the room, it transfers it to chilled facility water via a liquid-to-liquid heat exchanger
2x NVIDIA RTX A4500, 16GB GDDR6, 5,888 CUDA
or 2x NVIDIA Quadro 5000 Ada GDDR6, 9,728 CUDA
- Appearance/ Dimension/ Drawing Diagram
System |
|
CPU |
Intel® i7-6820EQ processor (Skylake), Up to 4 cores (TDP 45W) |
Memory type |
16GB DDR4-2133MHz ECC |
GPU |
2x NVIDIA ® MXM A4500, 16GB, 5888 CUDA Or 2x NVIDIA® MXM 5000 Ada, 16GB, 9728 CUDA. |
Storage |
|
Nano |
On board 128G SSD |
Side I/O (D38999) |
|
X1 |
1x USB3.0 |
X2 |
1x GLAN |
X3 |
1x HDMI |
DC- IN |
1 |
OS support list |
|
OS |
Microsoft Windows 7/8.1/10( 32/64-bit ) ,Linux |
Thermal |
|
Liquid Cooled |
Facility Excahnged by Liquid Over Conduction system |
Mechanical |
|
Power Requirement |
18V~36V DC-IN |
Dimension |
190 x 496 x 269mm (W x D x H) |
Weight |
30 KG |