DGX10
NVIDIA DGX Spark™ GB10 Rugged Computer
- Built on NVIDIA GB10 Grace Blackwell Superchip
- NVIDIA Blackwell GPU with Fifth-Generation Tensor Core
- NVIDIA Grace CPU with 20 Cores High Performance Arm Architecture
- UP to 1000 TOPs of AI Performance Using FP4
- 128G of Coherent, Unified System Memory
- Up to 4TB of NVMe Storage
- ConnectX-7 Smart NIC 2 x 200GbE
- MIL-STD-810 Standards with D38999 Connectors
- Ruggedized Compact Small Form Factor
- Technical Profile
- Specifications
- Edge AI Inference Built on NVIDIA Grace Blackwell for LLMs
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The DGX10 is a ruggedized AI computing platform designed to address the increasing size and complexity of generative AI models. Built on the NVIDIA Grace Blackwell Superchip and optimized for a desktop form factor, the DGX10 integrates a high-performance 20-core Arm CPU—featuring 10 Cortex-X925 and 10 Cortex-A725 cores—to accelerate data preprocessing and orchestration, significantly enhancing model tuning and real-time inferencing. The Grace Blackwell Superchip leverages NVLink™-C2C to deliver a coherent CPU–GPU memory model with six times the bandwidth of PCIe Gen 5. Complementing this architecture, the DGX10 features a powerful NVIDIA Blackwell GPU with 5th Gen Tensor Cores and FP4 support, delivering up to 1,000 TOPS of AI compute.
- High-Capacity, Secure Storage and Networking
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The DGX10 features up to 128 GB of coherent unified system memory and up to 4 TB of NVMe M.2 storage with built-in self-encryption, enabling secure, high-speed local data processing at the edge. This architecture supports mission-critical workloads that require low latency, data sovereignty, and operation in disconnected or denied environments. Integrated ConnectX-7 Smart NIC support delivers high-performance networking up to 400 GbE, enabling rapid sensor data ingestion, distributed AI inference, and secure edge-to-cloud or edge-to-edge communications. These capabilities make DGX10 well suited for military applications such as ISR data processing, autonomous systems control, tactical decision support, electronic warfare analytics, and forward-deployed AI inference where performance, security, and resilience are essential.
- Military Ruggedization with Robust D38999 Connectors
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Designed to meet MIL-STD-810 requirements and stringent size, weight, and power (SWaP) constraints, the DGX10 is built for deployment in harsh operational environments. The system incorporates robust DTL-38999 military connectors and a sealed, compact chassis that protects internal electronics from sand, dust, humidity, and salt fog. Meeting the MIL-STD-461 EMI/EMC standards, the DGX10 passes extensive environmental testing, including shock and vibration, voltage spikes, electrostatic discharge, and extreme temperature exposure—making it a reliable edge AI inference platform for defense, aerospace, and industrial applications.
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System |
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Processor |
20 core Arm (10 Cortex-X925 + 10 Cortex-A725 Arm) |
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Memory Type |
128 GB LPDDR5x, unified system memory 256-bit 273 GB/s |
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Architecture |
NVIDIA Grace Blackwell |
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GPU |
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CUDA Cores |
NVIDIA Blackwell Architecture |
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Tensor Cores |
5th Generation |
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RT Cores |
4th Generation |
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Tensor Performance |
1000 AI TOPS |
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NIC |
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Smart NIC |
ConnectX-7 Smart NIC |
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Ethernet Speeds |
10/25/40/50/100/200/400GbE |
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Network |
Wi-Fi 7, Bluetooth 5.4 |
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Storage |
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HDD/SSD |
Up to 4TB NVME.M2 with Self-encryption |
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Front I/O |
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X1 (DC-IN) |
1 x Amphenol 24FC4PN (4PIN) |
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X2 (HDMI) |
1x Amphenol HDMIFTV2AGF459 |
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X3 (10GbE) |
1x Amphenol RJFTV6A7SA1N |
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X4~X6 (USB 3.2 Gen 2) |
1 x Amphenol USB3CFTV7NF459 |
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X7 (100GbE) |
1 x Amphenol FSI MPOFTV70ZNN |
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Power button |
1 with Power LEDs |
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Power Requirement |
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Power Input |
AC 110V~240V 240W, 48V output with MIL-STD-461 Filter |
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Applications, Operating System |
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Operating System |
NVIDIA DGX OS 7.3.1 |
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NVIDIA GPU Driver |
580.95.05 |
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NVIDIA CUDA Toolkit |
13.0.2 |
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Physical |
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Dimensions |
250 x 250 x 138 mm ( H x W x D) |
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Estimated Weight |
5 kg (11.02lbs) Final Weights Dependent on Specific Configuration |
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Chassis |
Aluminum Alloy, Corrosion Resistant |
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Finish |
Anodic Aluminum Oxide |
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Cooling |
Conduction Cooling with Air Force Smart Fan Ingress Protection |
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Ingress Protection |
IP65 |
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MIL-STD-810 Standards |
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High Temperature |
High Temperature Storage |
+74°C per MIL-STD-810G/501.5/I for 7 Cycles |
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High Temperature |
High Temperature Operation |
55°C per MIL-STD-810G/501.5/II for 3 Cycles |
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Low Temperature |
Low Temperature Storage |
-46°C for 72 Hours Per MIL-STD-810G/502.5/I |
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Low Temperature |
Low Temperature Operation |
-33°C per MIL-STD-810G/502.5/II |
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Vibration |
C-130(J/K) aircraft |
Test Duration 400 Minutes Per Axis (x,y,z), Simulating 120 Flight Hours Including 20 Landings and TakeOffs |
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Functional Vibration |
Vibration Experienced on Ford F-550 in Neutral Gear |
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Tactical Transportation test not Operational |
Test Duration: 120 Minutes Per Axis to Simulate 500,000 km Driving Distance. |
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Shock |
Road Transportation |
10 Grms, 11ms, 3 (X, Y, Z) axes, Sawtooth Pulse |
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Immersion |
Method 502.5 |
Test According to IEC 60529/ IP65 |
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MIL-STD-461 Standards |
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Conducted Emissions Power Leads |
CE102 |
10KHz to 10MHz (Figure CE102-1) |
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Conducted Susceptibility Power Leads |
CE101 |
30Hz to 150KHz (Figure CS101-1: Curve #2) |
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Conducted Susceptibility, Bulk Cable Injection |
CS114 |
10KHz to 200MHz, curves 3&4 (10 kHz to 2 MHz: Curve #3 2MHz to 200MHz: Curve #4) |
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Conducted Susceptibility, Bulk Cable Injection |
CS115 |
Impulse Excitation (5A) |
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Conducted Susceptibility Damped Sinusoidal Transients, Cables and Power Leads |
CS116 |
10KHz to 100MHz(10A) |
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Radiated Emissions Electric Filed |
RE102 |
2MHz to 18GHz (Figure RE102-4) |
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Radiated Susceptibility Electric Filed |
RS103 |
2MHz to 18GHz, 50V/m (2MHz to 100MHz: 50V/m 100MHz to 18GHz: 50V/m) |
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