ROC640-8G

Intel^® 6^th Xeon^®SP 8xGPU (H100/RTX 6000 Pro) HPC

Dual Intel^® 6^th Xeon^® SP 6700P/E Series Processor
8 x 350W Double Width GPU Cards
8 x PCIe5.0 x16 FHFL Slots + 3 x PCIe5.0 x8 FHFL Slots
4 x NVMe PCIe U.2
2 x 1GLAN, 1x IPMI LAN, 4 x USB3.2, 1 x VGA
4 x 2000W Power Modules, Supporting 2- + -2, 3- + -1 Redundancy, with Hot-Swappable Support
MIL-STD-810G Thermal, Shock and Vibration

Download

Datasheet

Get A Quote

Technical Profile
Specifications

Introduction

The ROC640-8G 4U Rugged HPC is engineered to deliver uncompromising performance in the most demanding environments. Powered by dual Intel® 6th gene Xeon® SP processors, it provides exceptional computing power for mission-critical applications such as defense, aerospace, and industrial automation. Designed with flexibility in mind, the ROC640-8G supports up to 8 dual width PCIe5.0 x16 +3 Single width PCIe5.0 x8 expansion slots — ensuring compatibility with the latest high-performance GPUs, FPGAs, and networking cards.

Built to meet MIL-STD-810G standards, the ROC640-8G ensures reliable performance under extreme temperatures, shock, and vibration. Its rugged 4U chassis supports four swappable 2.5” SATA/NVMe SSD drive bays for flexible storage configuration. The system offers robust connectivity, including dual 1G LAN ports, an IPMI management LAN, USB 3.2, and VGA interfaces. Delivering an optimal balance of rugged durability, high-speed processing, and scalable expansion, the ROC640-8G is an ideal solution for field-deployed high-performance computing applications.

Appearance

System
Processor	6^th Gen Intel^® Xeon^® Scalable Processors, Dual Socket E (LGA-4710)
CPU Core Count	Up to 86C/172T; Up to 336MB Cache
Memory Type	DDR5-6400MT/s RDIMM ECC , Up to 4TB in 16+16 DIMM Slot
Expansion	8 x PCIe5.0 x16 Dual-width, Full-height, Full-length (FHFL) 3 x PCIe5.0 x8 Single-width, Full-height, Full-length (FHFL)
TPM	Chipset: Infineon, Type: TPM 2.0
IPMI	ASPEED AST2600 IPMI 2.0
BIOS	AMI UEFI BIOS
USB	4 x USB3.2 Type-A
Ethernet	2 x GLAN RJ45 1 x RJ45 Dedicated IPMI
Power Type	AC 100V-240V, 4 x 2000W power modules, supporting 2- + -2, 3- + -1 Redundancy, with Hot-Swappable Support.
Storage	4 x 2.5” Swappable SATA/NVMe Drive Bays
Display Port	1 x VGA
Operating Temp.	-10°C to +35°C
Dimensions	447 x 800 x 175 mm (W x D x H)
Front I/O
USB	4 x USB3.2 Type-A
Display	1x VGA
UID	1 x UID Switch
Power switch	1 x with LED
Reset Button	1
NMI Button	1
SSD/System LED	1+1
IPMI LAN	1
LAN	2 x RJ45
Rear I/O
Power In	4 x 2000W power modules, redundancy, with hot-swappable support.
MIL-STD-810 Environment Testing Standards
MIL-STD-810 Test	Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating) Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24, Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Reliability	Rugged Air Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program.
CE / FCC	Compliance
Operating Temp	-10°C to +35°C
Storage Temp.	-40°C to +80°C
Relative Humidity	5% to 95%, Non-Condensing