ROC640-8G
Intel® 6th Xeon®SP 8xGPU (H100/RTX 6000 Pro) HPC
- Dual Intel® 6th Xeon® SP 6700P/E Series Processor
- 8 x 350W Double Width GPU Cards
- 8 x PCIe5.0 x16 FHFL Slots + 3 x PCIe5.0 x8 FHFL Slots
- 4 x NVMe PCIe U.2
- 2 x 1GLAN, 1x IPMI LAN, 4 x USB3.2, 1 x VGA
- 4 x 2000W Power Modules, Supporting 2- + -2, 3- + -1 Redundancy, with Hot-Swappable Support
- MIL-STD-810G Thermal, Shock and Vibration
- Technical Profile
- Specifications
- Introduction
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The ROC640-8G 4U Rugged HPC is engineered to deliver uncompromising performance in the most demanding environments. Powered by dual Intel® 6th gene Xeon® SP processors, it provides exceptional computing power for mission-critical applications such as defense, aerospace, and industrial automation. Designed with flexibility in mind, the ROC640-8G supports up to 8 dual width PCIe5.0 x16 +3 Single width PCIe5.0 x8 expansion slots — ensuring compatibility with the latest high-performance GPUs, FPGAs, and networking cards.
Built to meet MIL-STD-810G standards, the ROC640-8G ensures reliable performance under extreme temperatures, shock, and vibration. Its rugged 4U chassis supports four swappable 2.5” SATA/NVMe SSD drive bays for flexible storage configuration. The system offers robust connectivity, including dual 1G LAN ports, an IPMI management LAN, USB 3.2, and VGA interfaces. Delivering an optimal balance of rugged durability, high-speed processing, and scalable expansion, the ROC640-8G is an ideal solution for field-deployed high-performance computing applications.
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- Appearance
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System |
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Processor |
6th Gen Intel® Xeon® Scalable Processors, Dual Socket E (LGA-4710) |
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CPU Core Count |
Up to 86C/172T; Up to 336MB Cache |
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Memory Type |
DDR5-6400MT/s RDIMM ECC , Up to 4TB in 16+16 DIMM Slot |
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Expansion |
8 x PCIe5.0 x16 Dual-width, Full-height, Full-length (FHFL) 3 x PCIe5.0 x8 Single-width, Full-height, Full-length (FHFL) |
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TPM |
Chipset: Infineon, Type: TPM 2.0 |
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IPMI |
ASPEED AST2600 IPMI 2.0 |
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BIOS |
AMI UEFI BIOS |
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USB |
4 x USB3.2 Type-A |
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Ethernet |
2 x GLAN RJ45 1 x RJ45 Dedicated IPMI |
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Power Type |
AC 100V-240V, 4 x 2000W power modules, supporting 2- + -2, 3- + -1 Redundancy, with Hot-Swappable Support. |
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Storage |
4 x 2.5” Swappable SATA/NVMe Drive Bays |
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Display Port |
1 x VGA |
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Operating Temp. |
-10°C to +35°C |
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Dimensions |
447 x 800 x 175 mm (W x D x H) |
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Front I/O |
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USB |
4 x USB3.2 Type-A |
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Display |
1x VGA |
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UID |
1 x UID Switch |
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Power switch |
1 x with LED |
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Reset Button |
1 |
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NMI Button |
1 |
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SSD/System LED |
1+1 |
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IPMI LAN |
1 |
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LAN |
2 x RJ45 |
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Rear I/O |
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Power In |
4 x 2000W power modules, redundancy, with hot-swappable support. |
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MIL-STD-810 Environment Testing Standards |
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MIL-STD-810 Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating) Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24, Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
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| Reliability |
Rugged Air Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program. |
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CE / FCC |
Compliance | |
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Operating Temp |
-10°C to +35°C | |
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Storage Temp. |
-40°C to +80°C | |
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Relative Humidity |
5% to 95%, Non-Condensing | |
