AV600-TH-A10H

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AV600X-TH-A10H正右有蓋
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Military IP66 Mission GPU Computer

  • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
  • IP66 Chassis with D38999 connectors
  • Intel® 11th Gen. Tiger Lake (H) Xeon® W-11865MLE processor
  • Up to 96 GB DDR4 SO-DIMM, non-ECC and ECC
  • NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
  • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
  • Extreme Temperature : -40°C to +60°C
  • Optional with External GPU Turbo Kit
  • Dimensions : 250(L) x 325 (W) x 100 (H) mm

     Special Request :

  • Frame Grabber : 4 x CH HD-SDI
  • Discrete IO : 4 x DI 4 x DO
  • 10GbE : Dual 10GbE (Intel X710) Ethernet Ports 
  • Dual Redundant MIL-STD-1553 connections 
  • Dual ARINC 429 input connections 
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 Introduction

AV600X-TH is driven by Intel® 11 Gen. Tiger Lake-H Xeon Processors. These processors are manufactured on Intel's most up-to-date and optimized 14 nm technology, up to 8 CPU cores. It is high computing performance and flexibility for heavier IoT workloads. The H-series processors are ideally suited for space-constrained and purpose-built designs. Multiple offerings for scalable performance, enhanced performance over previous generation with up to 8 cores.

AV700CH
Designed for Harsh Environment

AV600TH highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connectors and full IP66 protection allow system withstand in any kind of harsh environment. AV600TH supports extended temperature from -40°C to 55°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. 

 

Block Diagram
AV600X-TH Block Diagram

 

Appearance

 

CE Verification
CE Verification

 

System

CPU

Xeon W-11865MLE (8 Cores/16 Threads, 24M Cache, up to 4.50 GHz), 25W

Memory type

4x 260 Pin DDR4 2400MHz SO-DIMM (up to 96GB, XEON®SKU support ECC)

CHIPSET

CM246

GPU

NVIDIA RTX™ A1000 embedded graphics

- Standard MXM 3.1 Type A (82 x 70 mm)

- 2048 CUDA® cores, 16 RT Cores, and 64 Tensor Cores

- 6.66TFLOPS peak FP32 performance

- 4GB GDDR6 memory, 128-bit
On board Storage mSATA 512GB

Expansion Slot

1x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x 4 NVMe)

2x Mini PCIe Full size (USB / PCIe and 1x micro SIM Card)

1x PCIe/104, 1x FPE
TPM TPM 2.0 (SLB9665)

VIDEO INPUT

 4 Channel capture module for 4 x SMA male connectors >(optional)

Storage
SATA 1x 2.5” SSD

M.2

1x 2280 M key (SATA only)

Ethernet

Ethernet (Internal)

2x 10/100/1000 Ethernet Ports

Front I/O
DC-in 1x DC-in , with D38999 connector   
X1 1x DVI , with D38999 connector 
X2 1x DVI , with D38999 connector 
X3 2x GLAN + 3x USB 2.0, with D38999 connector 
X4 4x RS232/422/485 + 4 BIT DIO, with D38999 connector  
LED 1x SSD/HDD LED indicator
switch 1x IP65 power button , with LED indicator

Power

Power input

MIL-STD -461 18V~36V DC-Input

Application, Operating System
Application Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.
Operating System Windows® 10 64-bit / Linux (support by request)

Physical

Dimension

246(L) x 325 (W) x 100 (H)mm

Weight

10.5 Kg

Chassis

Aluminum Alloy

Heatsink

Heatsink Aluminum Alloy, Corrosion Resistant

Environmental

Green Product

RoHS, WEEE compliance

Operating Temp.

-40°C to +60°C

Storage Temp.

-40°C to +85°C

Relative Humidity

5% to 95%, non-condensing
MIL-STC-810 Method 507.5, Procedure II ( Temperature & Humidity )
Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )
Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )
Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )
Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )
Method 501.5, Procedure I ( Storage/High Temperature )
Method 501.5, Procedure II ( Operation/High Temperature )
Method 502.5, Procedure I ( Storage/Low Temperature )
Method 502.5, Procedure II ( Operation/Low Temperature )
Method 503.5, Procedure I ( Temperature shock )
Reliability No Moving Parts; Passive Cooling.
Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program.
MIL-STD-461 CE102 basic curve, 10kHz - 30 MHz
RE102-4, (1.5 MHz) -30 MHz - 5 GHz
RS103, 1.5 MHz - 5 GHz, 50 V/m equal for all frequencies
EMC EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV
EN 61000-4-3: 10V/m
EN 61000-4-4: Signal and DC-Net: 1 kV
EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV
CE and FCC
Designed to Meet Items ( Options )
CS101, CS114, CS115, CS116
CE106, RE103, RS101  
MIL-STD-1275 Steady State 20V-33V
  Surge Low 18V/500ms
  Surge High 100V/500ms