AV710-VM-E
12 CH Video Management FPGA-GPU Based System
- 12 Video Input Includes 4 3G-SDI Frame Grabber with low latency and 8 Composite (PAL)
- Support up to 4 videos output channels
- Support Output channel a Bird's-Eye-View
- 360 Stitching View from 4 Digital Videos Channel
- Picture-In-Picture (PIP) up to 2 videos on top screen
- IP65 Sealed with External Cooling Blade
- MIL-STD-810 Thermal, Shock, Vibration, Humidity
- Power :18V~36V EMI Filter DC Input
- Technical Profile
- Specifications
- Order Information
- Video
- Introduction
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Artificial intelligence is quickly becoming one of the most crucial elements of business success. Today, deploying powerful computing platforms to accelerate and scale AI-based products and services while adapting them to harsh environments has become vital in many successful military applications. 7StarLake is innovating to address the emerging high-throughput inference market driven by IoT edge devices which are generating huge amounts of data. The combination of FPGA and NVIDIA Jetson AGX is a powerful solution for demanding and latency-sensitive workloads.
- Main Feature
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- Connection to 12 Video Input channels, including 4 3G-SDI video channels and 8 composite (PAL) Channels.
- Generate from 2 up to 4 video output channels.
- Keep Low Latency between input video channels and generated output video channels.
- Generated Output channel a Bird's-Eye-View created from 4 SDI input channels.
- Each output channel can be selected into one main channel.
- Up to 2 videos inserted on top screen - Picture-In-Picture (PIP).
- System Diagram
- System I/O
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Front I/O
Rear I/O
| System | |||
|---|---|---|---|
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CPU |
Intel® Xeon® W-11865MRE, 8 Cores, 24M Cache, 2.6GHz (4.7GHz), 45W (RM590E) Intel® Xeon® W-11865MLE, 8 Cores, 24M Cache, 1.5GHz (4.5GHz), 25W (RM590E) |
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| Memory Type | 96GB SO-DIMM, DDR4-3200MHz, in 3 SO-DIMM Slot, 4th DIMM by request. Dual Channel DDR4 3200MHz ECC support |
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| Chipset | Intel® RM590E/QM580E/HM570E Chipset | ||
| GPU | NVidia® RTX A2000, 4G/8G 2560 CUDA Cores, PCIe Gen3.0 x16 | ||
| Ethernet Controller |
Intel® I210 & I219LM GbE LAN(10/100/1000 Mbps supported) |
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| LAN |
2x 1GBase-T(Option) |
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Storage |
2x 1TB 2.5" SSD hot-swap, with AES function |
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| Power Type |
18V~36V EMI DC-IN |
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| Dimension | 250 x 350 x 100 mm (W x D x H) | ||
| Front I/O | |||
| COM | 2x RS232/485 | ||
| LAN | 2x GbE (Option) | ||
| USB 3.0 | 1x | ||
| USB 2.0 | 2x | ||
| Power | 1x 9V~36V DC-IN | ||
| LED | 1x SSD LED | ||
| PW Button | 1x Power Switch with LED Indicator | ||
| SSD | 2x SSD swap tray | ||
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Rear I/O |
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| PAL | 8x | ||
| SDI Input | 2x | ||
| SDI Output | 2x | ||
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Environmental |
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MIL-STD-810 Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
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| Reliability |
Conduction Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program. |
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| Operating Temp. | 0°C to +50°C | ||
| Storage Temp. | -40°C to +85°C | ||
| Relative Humidity | 5% to 95%, non-condensing | ||
| Operating System | |||
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Operating System |
Windows 10 64 Bit, Linux by option |
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RoHS |
RoHS compliant |
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