EN236A
1U Rackmount Fanless System with 3rd Gen. Intel® Core™ Processor,
EN50155 Certified, 33.6V~62.4V DC-IN, Smart UPS, Extended Temp. -40°C to 70°C
- Intel® Ivy Bridge Processor BGA Type i7-3517UE
- 1x DDR3 SO-DIMM up to 8 GB
- 2x 2.5" SATA III Storage
- Dual GbE LAN ports (M12 connector)
- 2x USB2.0, 1x VGA
- 33.6V~62.4V DC-IN
- Extended Temperature -40°C to 70°C
- EN50155 compliant
- Technical Profile
- Specifications
- CPU
- Thermal Solution
- Introduction
-
EN236A is 19" 1U Rack-mount Fanless rugged System, suitable for application such as railway, high-end automation etc. Powered by Intel® Ivy Bridge i7 CPU and HM76 chipset, the BGA type CPU i7-3517UE with dual cores performance has only 17W power consumption. The fanless design ensures silent operation and eliminates the possibility of gathering dust and external debris inflow which may cause system failure over time. EN236A integrates wide range DC input from 33.6V to 62.4V with extended temperature operation up to 70°C without CPU throttling. Moreover, being EN50155-certified, EN236A possesses high performance under various power supply conditions, especially in rolling stock equipment and railway application.
- Unique Features
-
EN50155 Compliant
EN50155 is an international standard covering electronic equipment used on rolling stock for railway applications. The standard covers aspects of this electronic equipment, including temperature, humidity, shock, vibration, and other parameters. EN236A is compliant with the essential sections of EN50155. Meet with most critical EN50155 Tx Class, EN236A can withstand environmental from -40°C to 70°C internal cubicle temp., cooling test -40°C for 2 hours, dry heat test 70°C for 6 hours. On vibration, 5 to 150 Hz 5 hours / axis (0.5 g) for non-operation, 5 to 150 Hz 10 mins / axis (0.1 g) for operation; Shock is test by Half Sine wave 50 m / s2 30ms on longitudinal, transverse and vertical make it a suitable solution for a variety of railway application, such as content server, passenger infotainment etc.
Internal Back up Battery Set and UPS
While facing main power sudden shut down, EN236A is proven to be strong enough to self-supply power due to internal battery set and UPS function. Build-in five 10V/2500mA batteries that can support maximum 30~31W by testing; together with UPS board allows EN236A to support up to extra 30 minutes in full loading (5 hours in idle mode). This is the most promising feature allows users to have enough time to shut down the system properly or back up the systems when facing unexpected interruption of power supply.
Removable SSD Tray
EN236A is designed to fulfill demands of different application. In order to have more flexibility and be more user-friendly, EN236A equipped 2 removable SSD trays. For applications which require frequent changes on storage of system, such as passenger infotainment, content server etc, EN236A is the best solution.
- EN236A main board: 3.5" SBC - OXY5336A
-
1. Intel Core i7 CPU soldering onboard
EN236A is based on 3.5" SBC—OXY5336A, powered by Intel Ivy Bridge i7-3517UE plus HM76 chipset soldered onboard. The processor supports 1.7GHz dual core but consumes only 17W which is relatively low power consumption. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the component, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection. Generally speaking, it is rare to find 1U rackmount system that is driven by Intel core i7 processor since it is hard to completely dissipate the heat generated by Intel core i7 CPU. Therefore, EN236A is comparatively valuable with its high computing power but fanless solutions.
2. Wide range temperature support
Following 7STARLAKE wide temp principal, OXY5336A is designed to fulfill running full speed in harsh environment from -40°C to 85°C. Not only the board is designed with truly wide temp industrial component, the BGA type CPU can also help to achieve better heat dissipation. OXY5336A is truly a rugged SBC ideal for high-end Automation, heavy-duty railway, drilling and energy applications.
Operating Temp. |
|
|---|---|
|
-40°C to 70°C |
|
System |
|
|
CPU |
Intel® Ivy Bridge 22nm Core™ i7/i5/i3, BGA type |
|
Chipset |
Intel® HM76 Express Chipset (Intel® BD82HM76 PCH) |
|
Power System |
EN50155 standard 48V solution (33.V to 62.4V DC in) |
|
Memory type |
1x DDR3 204-pin SO-DIMM 1333/1600 MHz up to 8GB |
|
Expansion Slot |
1x Mini PCIe |
|
Storage Device |
2x 2.5" SATA HDD/SSD (Easy Swap 2.5" HDD cage) |
Front I/O |
|
|
Power Button |
1x |
|
LED Indicator |
1x Power LED |
|
Ethernet |
2x M12 Connectors Extended from Front Window |
|
Power Input |
1x M12 Power Connectors |
Front Window |
|
|
VGA |
1x |
|
Ethernet |
2x Intel® 82579LM & 82574IT GbE LAN (support 10/100/1000 Mbps) |
|
COM |
1x RS232/422/485 with 5V/12V selectable |
|
USB |
2x USB 3.0 |
Rear I/O |
|
|
2.5" HDD/SSD Tray |
2x |
|
GND Screw |
1x |
OS support list |
|
|
Windows |
Windows 10 32/64bit |
|
Linux |
Fedora 20, Ubyntu 13.10, Ubuntu 14.04 |
Mechanical and Environment |
|
|
Power Requirement |
33.6V~62.4V DC-IN |
|
Dimension |
440 x 44 x 360 mm (17.32" x 1.73" x 14.17") |
|
Weight |
7.90 kg (17.4 lbs) |
|
Operating Temp. |
-40°C to 70°C (ambient with air flow) |
|
Storage Temp. |
-40°C to 85°C |
|
Relative Humidity |
10% to 95%, non-condensing |
Test Standard |
|
|
EMC |
CE, FCC Class A |
|
Railway |
EN50155 Compliant |
The whole thermal solution of EN236A consist of three heat transfer methods, heat conduction, heat convection and water circulation. For heat conduction, the solution utilizes a copper heat spreader directly contact with the processor and chipset. Further comes to water circulation that formed in heat pipe, the working fluid indirectly brings away the heat to dual side aluminum heat sink for faster heat dissipation. By adopting high efficiency thermal solution guarantees the system to operate smoothly under harsh environment -40°C to 70°C.
Device Model |
EN236A |
Tester |
Ian Huang |
| Tester Result | Pass |
| Test Temperature | High 0°C~70°C / Low -40°C~0°C |
| Test Time | 15 Hours/3 Hours |
| Test Standard | Reference IEC60068-2 |
| Test Software | Burning test v7.1, Crystal DiskMARK 3.03, Intel Extreme Tuning Utility |
| Criteria |
After testing, system can't halt. |
- Test Configuration
-
Device
Configuration
CPU Type
Intel Core i7-3517UE 1.7GHz
PCH
Intel® HM76
Memory
2GB DDR3 1333 MHz SODIMM
Test Software
Burnin test v7.1、Crystal DiskMARK3.03,
Intel Extreme Tuning Utility Iperf , AS SSD
Chamber
KSON THS-b4t-150 Chipeng SMO-3
- Thermal Measurement
-
7starlake provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performanceunder high temperature, thus 7starlake conducts long time experiments tomake sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, 7starlake is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 12.5 hours which at each temperature point we burn in EN236A for two hours, from 40°C to 70°C.
EN235A CPU Performance
Point
-40°C
-20°C
25°C
40°C
45°C
50°C
55°C
60°C
65°C
70°C
CPU T-J 2 21 58 66 75 77 84 86 96 97 CPU Die -9.6 11.6 47.0 52.9 62.2 66.8 70.4 74.8 81.3 86.5 Heatsink -14.2 -5.4 44.5 50.8 58.6 63.5 69.1 72.2 80.0 83.5 Δ1=(TJ-Die) 11.6 9.4 11 13.1 12.8 10.5 13.6 11.2 14.7 10.5 Δ2=(Die-HeatSink) 4.6 17.0 2.5 2.1 3.6 3.3 1.3 2.6 1.3 3.0 CPU Frenquency (GHz) 2.59 2.56 2.54 2.59 2.60 2.54 2.58 2.56 2.59 2.58
To meet the demands of customer's extended temperature requirements, the whole thermal solution of EN236 consist of three heat transfer methods, heat conduction, heat convection and water circulation. For heat conduction, the solution utilizes a copper heat spreader directly contact with the processor and chipset. Further comes to water circulation that formed in heat pipe, the working fluid indirectly brings away the heat to dual side aluminum heat sink for faster heat dissipation. By adopting high efficiency thermal solution guarantees the system operate smoothly under harsh environment -40°C to 70°C.
Honeycomb Dissipating Vents
The honeycomb vents are pre-drilled in rigid aluminum frames to fasten thermal convection and the airflow that will astonishingly enhances ventilation. The enclosure features large, open honeycomb vents on the top, instead of fan solution that allows natural convection cooling that gather dust easily.
Internal battery set and UPS function
EN236A equipped internal battery set and UPS function, this feature support power delay off up to 20~30 minutes which allow users to have enough time to shut down the system properly or back up the systems when facing unexpected interruption of power supply.
Copper heat pipes
Heat pipe transfers heat from the heat sources to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.
• 8.0 mm diameter heat pipe, 99.9% purity of copper
• High heat conductivity coefficient up to 5000!
Aluminum heat sink
Dual sided aluminum heat sink transfer heat from copper heat pipe and dissipate rapidly to surrounding air.
OXY5336A
3.5” OXY5336A SBC, powered by Intel Ivy Bridge i7-3517UE and HM76 chipset soldered onboard. The processor supports 1.7 GHz dual core but consumes only 17 W which is relatively low power consumption.