ROC230-AC

ROC230A_1U Short Depth with XEON D1700 Fanless Server
ROC230A_1U Short Depth with XEON D1700 Fanless Server_02

1U Fanless Server with Intel® XEON® D-1749NT

  • 1U 380 mm Short Depth Fanless Server
  • Intel Ice lake Xeon D-1749NT(10xC)
  • 100V ~ 240V AC-IN
  • Up to 128GB Registered ECC RDIMM DDR4-2666MHz
  • 2 x 25G SFP28, 2 x 10G RJ45, 1 x IPMI
  • 1 x VGA , 2 x USB3.0, 2 x USB2.0
  • 4 x Swappable SSD
  • PCIe x 16 Expansion (HHHL)
  • MIL-STD 810 Vibration, Shock, Thermal
  • Dimension : 380 x 430 x 44 mm
  • Extended Temperature -20°C to 60°C 
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Introduction

ROC230-AC, 19" 1U 380 mm, short depth Rackmount Fanless server is driven by Intel® Xeon®D-1736NT (2.7GHz, 8 Cores, 16 Threads, 15MB Cache), providing superior performance in data processing and supporting high flexibility in application.

With 44mm of height and 380mm of short depth, it's fit for rack mount, wall mount, and standalone application. Conduction cooled heat pipes and heat spreader are constructed on both component and system levels. Honeycomb vents are designed on the top, sides and back to allow natural convection cooling.

ROC230-AC's power design is for 100V – 240V AC-IN, which allows a flexible usage. ROC230-AC meets the demands of industrial embedded applied computing applications including the industrial PC platform, transaction, multimedia workstation, vehicle PC, and network server.

ROC230-AC_1

 

Ultra-High Intel® Xeon® ICE LAKE - D LCC Processor 

ICE LAKE -D LCC :

Intel® Xeon® processor D-1700 product family offers hardware and software scalability from two up to sixteen cores, making it the perfect choice for a broad range of high-performing, low-power solutions that will bring intelligence and Intel® Xeon® reliability, availability, and serviceability (RAS) to the edge.

 

Enhanced performance per watt:

Intel® Xeon® processor D-1700 product family delivers exceptional value and unmatched performance density per watt. Its TDP of 47W to 90W, industry-leading 14 nm process technology and a compute-only design make it ideal for meeting the diverse needs of customers seeking mid-range low-power, high-density solutions.
 

Enabling more IoT Use Cases:

The Intel® Xeon® processor D-1700 product Family drives a host of new IoT opportunities for a wide range of environments, while addressing real-time optimization, and workload consolidation. Its temperature rating spans from -40°C to 85°C operating ambient conditions, which establishes new possibilities for Intel® architecture in markets that require robust products, like aerospace and industrial. 

 

 

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Appearance

ROC230-AC_Front I/O

ROC230-AC_Rear I/O

 

System
High Performance Processor Intel® Xeon® D-1736NT (2.7GHz, 8 Cores, 16 Threads, 15MB Cache)
Intel® Xeon® D-1749NT (3.0GHz, 10 Cores, 20 Threads, 15MB Cache)
Memory Type Up to 128GB ECC RDIMM, DDR4-2666MT/s
Chipset SoC, integrated with CPU
IPMI ASPEED AST2600 BMC
Expansion Slot 1 x PCIe x 16 (HHHL)
Storage
SSD 4 x 2.5" Swappable SATAIII SSD
Ethernet
Ethernet 2 x Intel® SoC 25G SFP28
2 x Intel® X550-AT2 10G RJ45
Front I/O
Easy Swap SSD Tray 4
Button 1 x Power Button w/Indicator LED
Indicator LED SSD
USB 2 x USB2.0
Rear I/O
VGA 1
IPMI 1 x RJ45
Ethernet 2 x 25GbE SFP28
2 x 10GbE RJ45
USB Port 2 x USB3.0
PCIe Expansion 1 x PCIe x 16 slot (HHHL)
AC-IN 1 x AC plug
Power Requirement
Power Input AC-IN 100V ~ 240V
Operating System
Operating System

Windows 10 64bit Enterprise
Windows 10 64bit Pro Workstations
Windows 10 IoT 64bit Enterprise
Windows 11 64bit Enterprise
Windows 11 64bit Pro Workstations
Windows 11 IoT 64bit Enterprise
Windows Server 2019 64bit
Windows Server 2022 64bit
RHEL 8.3 64bit
RHEL 8.4 64bit
CentOS 8.3 64bit
CentOS 8.4 64bit
Oracle 8.3 64bit
Oracle 8.4 64bit
SLES 12 SP5 64bit
SLES 15 SP3 64bit
Ubuntu 20.04.3 64bit Server    
Ubuntu 21.10 64bit Server
FreeBSD 12.1
VMWare ESXi 7.0u3 x64
Physical & Environment
Dimension ( W x D x H ) 430 x 380 x 44.4 mm
Operating Temperature -20°C to 60°C
Storage Temperature -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Green Product RoHS Design to meet
EMC CE and FCC Design to meet
MIL-STD-810 MIL-STD-810 Design to meet : 
Method 501, Operational Temperature, high / Procedure II: +50°C, two-hour dwell, four cycles
Method 501, Storage Temperature, high / Procedure I: +70°C, two-hour dwell, four cycles
Method 502, Operational Temperature, low / Procedure II: -20°C, two-hour dwell, four cycles
Method 502, Storage Temperature, low / Procedure I: -40°C, two-hour dwell, four cycles
Method 514, Vibration / Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514, Vibration / Category 20/Operating (Category 20 & 24, Vibration)
Method 516, Shock / Procedure V Non-Operating (Mechanical Shock)
Method 516, Shock / Procedure I Operating (Mechanical Shock)

ROC230-AC-8C

1U 19” AC-DC Short Depth Fanless Server with Intel® Xeon® D-1736NT(8C) (TDP : 67W) Processor, Up to 128GB ECC RDIMM, DDR4-2666MT/s, 1 x IPMI, 2 x 25G SFP28, 2 x 10G RJ45, 1 x VGA, 4 x USB, 4 x Swappable SSD, 1 x Expansion Slot(HHHL), 100V~240V AC-IN, Operating Temp. -20~60°C

ROC230-AC-10C

1U 19” AC-DC Short Depth Fanless Server with Intel® Xeon®  D-1749NT(10C) (TDP : 90W)Processor, Up to 128GB ECC RDIMM, DDR4-2666MT/s, 1 x IPMI, 2 x 25G SFP28, 2 x 10G RJ45, 1 x VGA, 4 x USB, 4 x Swappable SSD, 1 x Expansion Slot(HHHL), 100V~240V AC-IN, Operating Temp. -20~60°C