ROC230-AC

ROC230A_1U Short Depth with XEON D1700 Fanless Server
ROC230A_1U Short Depth with XEON D1700 Fanless Server_02

1U Fanless Server with Intel® Xeon® D-1749NT

  • 1U 380 mm Short Depth Fanless Server
  • Intel Ice lake Xeon D-1749NT(10xC)
  • 100V~240V AC-IN
  • Up to 128GB Registered ECC RDIMM DDR4-2666MHz
  • 2 x 25G SFP28, 2 x 10G RJ45, 1 x IPMI
  • 1 x VGA , 2 x USB3.0, 2 x USB2.0
  • 4 x Swappable SSD
  • PCIe x16 Expansion (HHHL)
  • MIL-STD 810 Vibration, Shock, Thermal
  • Dimensions: 380 x 430 x 44 mm
  • Extended Temperature -20°C to 60°C 
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  • Technical Profile
  • Specifications
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Introduction

The ROC230-AC is a 19-inch 1U rackmount fanless server with a 380 mm short-depth design, powered by the Intel® Xeon® D-1736NT processor (2.7 GHz, 8 cores, 16 threads, 15 MB cache). It delivers high-performance data processing while offering flexibility for a wide range of application scenarios.

With a height of just 44 mm and a compact 380 mm depth, the ROC230-AC supports rack-mounted, wall-mounted, and standalone installations. Its thermal design incorporates conduction-cooled heat pipes and heat spreaders at both the component and system levels. Honeycomb ventilation on the top, sides, and rear enables efficient natural convection cooling, ensuring reliable fanless operation.

Designed for global deployment, the ROC230-AC supports a wide AC input range of 100–240 V. It is well suited for industrial embedded computing applications, including industrial PC platforms, transaction systems, multimedia workstations, vehicle PCs, and network servers.

ROC230-AC_1

 

Ultra-High-Performance Intel® Xeon® Ice Lake-D LCC Processor

ICE LAKE -D LCC :

The Intel® Xeon® Processor D-1700 product family delivers hardware and software scalability ranging from 2 to 16 cores, making it an ideal solution for high-performance, low-power applications. It brings intelligence and enterprise-class Intel® Xeon® reliability, availability, and serviceability (RAS) capabilities to edge computing environments across a wide range of use cases.

Enhanced performance per watt:

The Intel® Xeon® Processor D-1700 delivers exceptional value and unmatched performance density per watt. With a TDP range of 47 W to 90 W, advanced 14 nm process technology, and a compute-optimized design, it is well suited to address the requirements of customers seeking mid-range, low-power, high-density computing solutions.

Enabling more IoT Use Cases:

The Intel® Xeon® Processor D-1700 enables a wide range of new IoT opportunities across diverse deployment environments while supporting real-time optimization and workload consolidation. With an operating ambient temperature range of –40 °C to 85 °C, it extends Intel® architecture into demanding markets that require ruggedized solutions, such as aerospace and industrial applications.

 

 

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Appearance

ROC230-AC_Front I/O

ROC230-AC_Rear I/O

 

System
High Performance Processor Intel® Xeon® D-1736NT (2.7GHz, 8 Cores, 16 Threads, 15MB Cache)
Intel® Xeon® D-1749NT (3.0GHz, 10 Cores, 20 Threads, 15MB Cache)
Memory Type Up to 128GB ECC RDIMM, DDR4-2666MT/s
Chipset SoC, integrated with CPU
IPMI ASPEED AST2600 BMC
Expansion Slot 1 x PCIe x 16 (HHHL)
Storage
SSD 4 x 2.5" Swappable SATAIII SSD
Ethernet
Ethernet 2 x Intel® SoC 25G SFP28
2 x Intel® X550-AT2 10G RJ45
Front I/O
Easy Swap SSD Tray 4
Button 1 x Power Button w/Indicator LED
Indicator LED SSD
USB 2 x USB2.0
Rear I/O
VGA 1
IPMI 1 x RJ45
Ethernet 2 x 25GbE SFP28
2 x 10GbE RJ45
USB Port 2 x USB3.0
PCIe Expansion 1 x PCIe x 16 slot (HHHL)
AC-IN 1 x AC plug
Power Requirement
Power Input AC-IN 100V ~ 240V
Operating System
Operating System

Windows 10 64bit Enterprise
Windows 10 64bit Pro Workstations
Windows 10 IoT 64bit Enterprise
Windows 11 64bit Enterprise
Windows 11 64bit Pro Workstations
Windows 11 IoT 64bit Enterprise
Windows Server 2019 64bit
Windows Server 2022 64bit
RHEL 8.3 64bit
RHEL 8.4 64bit
CentOS 8.3 64bit
CentOS 8.4 64bit
Oracle 8.3 64bit
Oracle 8.4 64bit
SLES 12 SP5 64bit
SLES 15 SP3 64bit
Ubuntu 20.04.3 64bit Server    
Ubuntu 21.10 64bit Server
FreeBSD 12.1
VMWare ESXi 7.0u3 x64
Physical & Environment
Dimensions ( W x D x H ) 430 x 380 x 44.4 mm
Operating Temperature -20°C to 60°C
Storage Temperature -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Green Product RoHS (designed to meet)
EMC CE and FCC (designed to meet)
MIL-STD-810 MIL-STD-810 designed to meet : 
Method 501, Operational Temperature, high / Procedure II: +50°C, two-hour dwell, four cycles
Method 501, Storage Temperature, high / Procedure I: +70°C, two-hour dwell, four cycles
Method 502, Operational Temperature, low / Procedure II: -20°C, two-hour dwell, four cycles
Method 502, Storage Temperature, low / Procedure I: -40°C, two-hour dwell, four cycles
Method 514, Vibration / Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514, Vibration / Category 20/Operating (Category 20 & 24, Vibration)
Method 516, Shock / Procedure V Non-Operating (Mechanical Shock)
Method 516, Shock / Procedure I Operating (Mechanical Shock)

ROC230-AC-8C

1U 19” AC-DC Short Depth Fanless Server with Intel® Xeon® D-1736NT(8C) (TDP : 67W) Processor, Up to 128GB ECC RDIMM, DDR4-2666MT/s, 1 x IPMI, 2 x 25G SFP28, 2 x 10G RJ45, 1 x VGA, 4 x USB, 4 x Swappable SSD, 1 x Expansion Slot(HHHL), 100V~240V AC-IN, Operating Temp. -20~60°C

ROC230-AC-10C

1U 19” AC-DC Short Depth Fanless Server with Intel® Xeon®  D-1749NT(10C) (TDP : 90W)Processor, Up to 128GB ECC RDIMM, DDR4-2666MT/s, 1 x IPMI, 2 x 25G SFP28, 2 x 10G RJ45, 1 x VGA, 4 x USB, 4 x Swappable SSD, 1 x Expansion Slot(HHHL), 100V~240V AC-IN, Operating Temp. -20~60°C