AV800-H32
AV800-H32
IP65 Military Xeon® 6 Granite Rapids D, 32C, 100G QSFP28 MXM RTX5000 (Ada) GPU Server
- Intel® Xeon® 6 Granite Rapids SoC 6546P-B, 32Cores
- DDR5 up to 6400MT/s , up to 512GB
- 2 x 2TB U.2 NVMe SSD Storage
- NVIDIA RTX 5000 Ada GPU 9,728 CUDA cores
- 18-36V DC-DC
- 4 x SFP28 50GbE , 1GbE-T share with IPMI
- Operating Temperature: -20°C to +60°C
- IP65 Sealed with External Cooling Blade
- Technical Profile
- Specifications
- Thermal Solution
- Video
- Introduction
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Powered by the Intel® Xeon® 6 Granite Rapids D 6546P-B processor (32 cores, 2.3 GHz base, up to 3.5 GHz turbo), the AV800-H32 is a rugged, AI-enabled server equipped with an Nvidia RTX5000 (Ada) GPU and dual 100GbE QSFP28 (SoC) interfaces for high-speed connectivity.
With built-in acceleration from Intel® Deep Learning Boost, the AV800-H32 delivers high-performance computing for rugged IoT environments. Combining exceptional inference capabilities with high-bandwidth 200 Gb/s networking, it serves as an ideal HPC platform for a wide range of edge AI applications.
Designed with the NVIDIA MXM RTX5000 (Ada) GPU (Ada Lovelace architecture, 9,728 CUDA cores, 76 RT cores, and 304 Tensor cores), the AV800-H32 delivers powerful performance for data-intensive industries such as defense and transportation.
With dual 100GbE QSFP28 (SoC) ports, the rugged GPU server supports high-speed 100 Gb/s Ethernet connectivity and integrates a secure, intelligent SmartNIC. This enhances performance, security, virtualization, SDN/NFV, big data analytics, and machine learning for modern data center applications.
- Intel® Xeon® 6 SoC for Extreme Edge Performance
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Built on the Intel® Xeon® D 6546P-B, the AV800-H32 delivers peak performance without compromise:
- 32 Cores /64 Threads: Enables parallel processing for compute-intensive workloads in mission-critical applications.
- 195W TDP: Balances high processing power with thermal efficiency, perfect for conduction-cooled platforms.
- Extended Temperature Range -40°C to 85°C: Engineered for true military-grade reliability in harsh and rapidly changing environments.
- Embedded PCIe 5.0, DDR5, and Networking Controllers
- Intel® QuickAssist Technology (QAT): Provides built-in hardware acceleration for encryption, decryption, and compression, significantly offloading these tasks from the CPU and improving system throughput for secure data communications and storage.
- Intel® AVX-512 Support: Advanced Vector Extensions enable high-performance parallel processing for AI inference, signal processing, real-time analytics, and sensor fusion, critical for defense and edge applications requiring rapid data processing at the tactical level.
- Block Diagram
- Appearance
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System |
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CPU |
Intel® Xeon® 6 SoC 6546P-B, 32 Cores, 2.3GHz/3.5GHz TDP 195W |
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Memory Type |
Up to 512GB RDIMM, 4CH DDR5 6400 MHz in 4 Slots |
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Chipset |
SoC |
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IPMI |
ASPEED AST2600 |
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GPU |
Nvidia RTX 5000 (Ada) GPU 9,728 CUDA 16GB GDDR6 |
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Storage |
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HDD/SSD |
2 x 2TB U.2 NVMe SSD |
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Ethernet |
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Ethernet |
4 x 50GbE QSFP28 + 1x IPMI shared LAN 1 x GbE RJ45 |
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OS Support List |
Windows 11, RHEL 9.4 64bit, RHEL 9.5 64bit, Oracle 9.4 64bit, Oracle 9.5 64bit, Rocky Linux 9.4 64bit, Rocky Linux 9.5 64bit, SLES 15 SP6 64bit, Ubuntu 24.04.1 64bit Server, VMWare ESXi 8.0U2 |
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Power |
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Power Requirement |
18~36V 500W DC Power Supply |
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Dimensions |
410 x 400 x 195 mm (WxDxH) final size is dependent on specific configuration |
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Weight |
≦ 18 kg final weight is dependent on specific configuration |
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Front I/O |
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X1 (DC-In) |
1 x D38999 connector |
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X2 (USB3.0) |
1 x D38999 connector |
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X3 (50GbE LAN) |
1 x D38999 connector |
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X4 (50GbE LAN) |
1 x D38999 connector |
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X5(1GbE IPMI) |
1 x D38999 connector |
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X6 (50GbE LAN) |
1 x D38999 connector |
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X7 (50GbE LAN) |
1 x D38999 connector |
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Display |
1 x VGA (DB15 with cover) |
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| Environment | |||
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Operating Temp. |
-20°C to +60°C |
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Storage Temp. |
-30°C to +70°C |
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Relative Humidity |
5% to 95%, non-condensing |
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| MIL-STD-810 Environment Testing Standards | |||
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Method 501, Operational Temperature, high: |
Procedure II: +60°C, two-hour dwell, four cycles |
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Method 501, Storage Temperature, high: |
Procedure I: +70°C, two-hour dwell, four cycles |
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Method 502, Operational Temperature, low: |
Procedure II: -20°C, two-hour dwell, four cycles |
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Method 502, Storage Temperature, low: |
Procedure I: -30°C, two-hour dwell, four cycles |
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Method 514, Vibration: |
Category 24/Non-Operating (Category 20 & 24, Vibration) |
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Method 514, Vibration: |
Category 20/Operating (Category 20 & 24, Vibration) |
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Method 516, Shock: |
Procedure V Non-Operating (Mechanical Shock) |
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Method 516, Shock: |
Procedure I Operating (Mechanical Shock) |
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Method 507, Humidity: |
Procedure II: exposure to 10 cycles of 95% relative humidity at temperatures of 30 °C to 60 °C with conformal coating (optional) |
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Method 509, Salt fog: |
Each cycle consists of 24 hours in salt-fog conditions of 5%NaCl, 95% relative humidity and 35 °C followed by 24 hours of drying in an environment with less than 50% relative humidity (optional) |
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Method 500, Altitude (Low Pressure): |
15,000 feet transport, -200÷2500[m] ground operation and exposed to +55°C and -20°C operation (optional) |
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Method 510, Sand-Dust: |
Procedure I: Blasting dust, 12 hours (optional) |
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Method 508, Fungus: |
28 days, mixed spore, 30°C 95% RH (optional) |
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| MIL-STD-461 ELECTROMAGNETIC Testing Standards | |||
| CE102 | Conducted emissions, power leads, 10KHz to 10MHz | ||
| RE102 | Radiated emissions, electric filed, 30MHz to 5GHz | ||
| RS103 | Radiated susceptibility, electric filed, 80Mhz to 3GHz | ||
| CS101 | Conducted susceptibility, power leads, 30Hz to 150KHz (Figure CS101-1: Curve #2) (optional) | ||
| CS114 | Conducted susceptibility, bulk cable injection, 10KHz to 200MHz, curves 3&4 (10 kHz to 2 MHz: Curve #3 2MHz to 200MHz: Curve #4) (optional) | ||
| CS115 | Conducted susceptibility, bulk cable injection, impulse excitation (5A) (optional) | ||
| CS116 | Conducted susceptibility, damped sinusoidal transients, cables and power leads, 10KHz to 100MHz (10A) (optional) | ||
| CS118 | Personnel borne electrostatic discharge (optional) | ||
