7SL-XR5610
Intel 4/5th XEON SP 1U Short depth Military Rugged HPC
- Intel® 4th Xeon Scalable Processor CPUs with up to 32 Cores
- Intel 5th Xeon® Scalable Processor CPUs with up to 16 Cores
- 8 DDR5 DIMM slots, supports RDIMM 1 TB max, speeds up to 5600 MT/s.
- Front bays: Up to 4 x 2.5-inch SATA, SAS, or NVMe SSDs max 30.72 TB
- Cryptographically signed firmware, Secure Boot, TPM 2.0 FIPS, CC-TCG certified
- 4x 25G LAN SFP+, 1x RJ45 1GbE LAN, 1x USB 3.0, 1x USB2.0, 1x Mini-DP
- Up to 2 PCIe slots (2 x16 Gen5)
- Redundant 14000W Platinum power supply support 100V-240V, 240V HVDC support 1+1 active-active support hot plug
- Embedded Management: iDRAG Direct, iDRAC RESTful API with Redfish iDRAC Service
- Conformal coating (Optional)
- Design to meet MIL-STD-461/MIL-STD-810
- Technical Profile
- Specifications
- Order Information
- Product Highlight
-
Technical Specification
5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E)
Up to 16/32 Cores per Processor
Up to 1TB memory with 8 DIMM slots
Storage Internal Controllers: PERC H965i, PERC H965e, PERC H755, PERC H355, HBA355i
(BOSS-N1): HWRAID 1, 2 x M.2 NVMe SSDs
Management and Operating System
Windows®, VMWARE, Ubuntu Server LTS, Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESX
AMI UEFI BIOS type
iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish, iDRAC Service Module, NativeEdge Endpoint Orchestrator
TPM 2.0 support
Expansion
Up to 2 x PCIe 5.0 x 16 Slots
4x 2.5” Swappable SSD, support SATAIII (6Gbps)
Input/Output Versatility
1x Power Button
1x SSD Status LED
2x AC-IN Jack
(Front)
1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0
(Rear)
1 x iDRAC dedicated port, 1 x USB 3.0, 1 x Serial (Micro- AB USB 2.0) port, 1 x Mini-DisplayPort, 1 x RJ45 for dry contact, 4 x 25 GbE SFP+ LOM
Power Supply Options
Redundant 1400 W Platinum 100/240V VAC
1100 W 48V~60V VDC (Optional)
Thermal Solution
Air Cooling 6 x Standard cold swap fans
Environmental
Operating
Temperature: -10°C to 55°C
Humidity: 5%to 95%, non-condensing
Shock: 3 axis, 25g
Vibration: 5Grms
Non-Operating
Temperature: -20°C to 60°C
Humidity: 5%to 95%, non-condensing
MIL-STD-810 Test
Method 500.5, Procedures I and II (Altitude, Operation):
12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)
Method 500.5, Procedures III and IV (Altitude, Non-Operation):
15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
Method 507.5, Procedure II (Temperature & Humidity)
Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating)
Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6, Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Mechanical
Height: 42.8mm
Width: 19 inches (482.6mm)
Depth: 22 inches (566.05mm) with bezel
18.61inches (472.7mm) without bezel
Weight: 25.06 pounds (11.37kg)
- Appearance
|
System |
|
|---|---|
| Processor |
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
| CPU Core Count | Up to 16 Cores/32 Cores |
| Memory Type |
DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot |
| TPM | Chipset: Infineon, Type: TPM 2.0 |
| IPMI |
iDRAC RESTful API with Redfish |
| BIOS | AMI UEFI BIOS |
| USB | 1x USB3.0 +1x USB2.0 ports |
| Ethernet | 4x 25G Ethernet SFP+ Ports |
| Power Type | 100V~240V AC IN Redundant |
| Storage | 4x 2.5” Swappable SATA SAS |
| Operating Temp. | -10°C to +55°C |
| Dimension | 482mm(W) x 566mm(D) x 42mm(H) |
| Front I/O | |
| Power Button |
1x |
| SSD LED indicator | 1x |
| Swappable SSD Tray | 4x |
| iDAC | 1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0 |
| StorageRear I/O | |
| iDAC | 1x iDRAC dedicated Direct port |
| USB3.0 | 1x |
| Serial | 1x (Micro-AB USB 2.0) |
| 1G LAN1 | 1x |
| 10 LAN | 4x |
| Display port | 1x Mini-DP |
| Environmental | |
| MIL-STD-810 Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating) Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
| Operating Temp. |
-10°C to +55°C |
| Storage Temp. |
-20°C to +60°C |
| Relative Humidity | 5% to 95%, non-condensing |
|
7SL-XR5610-AC |
7SL-XR5610-DC |
|
|
CPU |
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
|
RAM |
DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot |
DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot |
|
Storage |
4x 2.5” Swappable SATA SAS |
4x 2.5” Swappable SATA SAS |
|
Power |
1400W 100V~240V AC IN Redundant |
1100W DC 48V~60V |
|
Thermal |
Active Smart Fan Cooling |
Active Smart Fan Cooling |