7SL-XR5610
Intel 4/5th XEON SP 1U Dell Military Server
- Intel® 4/5th XEON® 1U Dell Military Server
- Up to 2x PCIe Gen5 low profile (two x16 PCIe Gen5)
- 4x 2.5” Swappable SATA SSD up to (RAID 0,1,5,10)
- 4x 25G GbE SFP+, 1x iDRAC Direct (Micro-AB USB 2.0), 1x iDRAC dedicated
- 1x USB 3.0, 1x Serial (Micro-AB USB2.0) port, 1x Mini-Display Port
- MIL-STD-810 Vibration Method 514.6: ◎Acceleration : 5.0 Grms
- MIL-STD-810 Vibration Method 514.6: ◎PSD : 0.01257 g2/Hz
- MIL-STD-810 Shock Method 516.6 : ◎Wave Form: Half Shine Wave
- MIL-STD-810 Shock Method 516.6 : ◎Acceleration: 20G
- MIL-STD-810 Temperature Method 501.5 502.5: ◎ Operating Temp High 55°C
- MIL-STD-810 Temperature Method 501.5 502.5: ◎ Operating Temp Low -30°C
- Technical Profile
- Specifications
- Order Information
- Download
7StarLake Partners with Dell to Deliver High-Level Ruggedized Servers for Extreme Environments
7StarLake, an industry leader in rugged computing solutions, proudly announces its status as an authorized partner of Dell, bringing advanced ruggedization to Dell’s high-performance server lineup. With a proven track record in military and defense applications, 7StarLake enhances Dell servers to withstand harsh environments, ensuring uncompromised reliability in extreme conditions.
By integrating MIL-STD-810G-certified vibration and shock resistance, 7StarLake fortifies Dell’s server platforms, including the XR-5610, XR-7620, and R760, against the toughest operational challenges. Furthermore, leveraging extensive expertise in thermal management, 7StarLake optimizes these servers to perform seamlessly in temperatures ranging from -30°C to +55°C, making them ideal for defense, aerospace, and industrial applications.
This collaboration underscores 7StarLake’s commitment to delivering mission-critical solutions, ensuring Dell’s cutting-edge technology thrives in the most demanding environments.

- MIL-STD 810 Test
-
Random Vibration Test (Operation)
Frequency :5~2000Hz 8.65grms
PSD: 0.0375g²/Hz
Test Axis X,Y,Z (Each axis)
Test Time: 30mins (Each axis)Random Vibration Test (None Operation mode)
Frequency :5~2000Hz 8.75 grms
PSD : 5Hz-15Hz : 0.16g²/Hz
Test Axis X,Y,Z (Each axis)
Test Time: 30mins (Each axis)Shock Test (Operation)
Wave Form Half Sine Wave
Acceleration 40g
Duration. 11ms
Shock Direction +- Z axisShock Test (None Operation mode)
Wave Form Half Sine Wave
Acceleration 75g
Duration. 11ms
Shock Direction +- Z axis
- Product Highlight
-
Technical Specification
- 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E)
- Up to 16/32 Cores per Processor
- Up to 1TB memory with 8 DIMM slots
- Storage Internal Controllers: PERC H965i, PERC H965e, PERC H755, PERC H355, HBA355i
- (BOSS-N1): HWRAID 1, 2 x M.2 NVMe SSDs
Management and Operating System
- Windows® , VMWARE, Ubuntu Server LTS, Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESX
- AMI UEFI BIOS type
- iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish, iDRAC Service Module, NativeEdge Endpoint Orchestrator
- TPM 2.0 support
Expansion
- Up to 2 x PCIe 5.0 x 16 Slots
- 4x 2.5” Swappable SSD, support SATAIII (6Gbps)
Input/Output Versatility
- 1x Power Button
- 1x SSD Status LED
- 2x AC-IN Jack
- (Front)
- 1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0
- (Rear)
- 1 x iDRAC dedicated port, 1 x USB 3.0, 1 x Serial (Micro- AB USB 2.0) port, 1 x Mini-DisplayPort, 1 x RJ45 for dry contact, 4 x 25 GbE SFP+ LOM
Power Supply Options
- Redundant 1400 W Platinum 100/240V VAC
- 1100 W 48V~60V VDC (Optional)
Thermal Solution
- Air Cooling 6 x Standard cold swap fans
Environmental
Operating
- Temperature: -10°C to 55°C
- Humidity: 5%to 95%, non-condensing
- Shock: 3 axis, 25g
- Vibration: 5Grms
Non-Operating
- Temperature: -20°C to 60°C
- Humidity: 5%to 95%, non-condensing
MIL-STD-810 Test
- Method 500.5, Procedures I and II (Altitude, Operation):
- 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)
- Method 500.5, Procedures III and IV (Altitude, Non-Operation):
- 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)
- Method 501.5, Procedure I (Storage/High Temperature)
- Method 501.5, Procedure II (Operation/High Temperature)
- Method 502.5, Procedure I (Storage/Low Temperature)
- Method 502.5, Procedure II (Operation/Low Temperature)
- Method 503.5, Procedure I (Temperature shock)
- Method 507.5, Procedure II (Temperature & Humidity)
- Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating)
- Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
- Method 514.6, Vibration Category 20/Operating (Category 20 & 24, Vibration)
- Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)
- Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Mechanical
- Height: 42.8mm
- Width: 19 inches (482.6mm)
- Depth: 22 inches (566.05mm) with bezel
- 18.61inches (472.7mm) without bezel
- Weight: 25.06 pounds (11.37kg)
- Appearance
System |
|
---|---|
Processor | 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
CPU Core Count | Up to 16 Cores/32 Cores |
Memory Type | DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot |
TPM | Chipset: Infineon, Type: TPM 2.0 |
IPMI | iDRAC RESTful API with Redfish |
BIOS | AMI UEFI BIOS |
USB | 1x USB3.0 +1x USB2.0 ports |
Ethernet | 4x 25G Ethernet SFP+ Ports |
Power Type | 100V~240V AC IN Redundant |
Storage | 4x 2.5” Swappable SATA SAS |
Operating Temp. | -10°C to +55°C |
Dimension | 482mm(W) x 566mm(D) x 42mm(H) |
Front I/O | |
Power Button | 1x |
SSD LED indicator | 1x |
Swappable SSD Tray | 4x |
iDAC | 1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0 |
StorageRear I/O | |
iDAC | 1x iDRAC dedicated Direct port |
USB3.0 | 1x |
Serial | 1x (Micro-AB USB 2.0) |
1G LAN1 | 1x |
10 LAN | 4x |
Display port | 1x Mini-DP |
Environmental | |
MIL-STD-810 Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating) Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
Operating Temp. | -10°C to +55°C |
Storage Temp. | -20°C to +60°C |
Relative Humidity | 5% to 95%, non-condensing |
7SL-XR5610-AC |
7SL-XR5610-DC |
|
CPU |
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
RAM |
DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot |
DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot |
Storage |
4x 2.5” Swappable SATA SAS |
4x 2.5” Swappable SATA SAS |
Power |
1400W 100V~240V AC IN Redundant |
1100W DC 48V~60V |
Thermal |
Active Smart Fan Cooling |
Active Smart Fan Cooling |
Attachment | Size |
---|---|
7SL-XR5610_Performance Test Report.pdf (5.72 MB) | 5.72 MB |
VS-TV-1140211-03百崴-RE-SH-Op-7SL-XR5610(20250205).pdf (931.01 KB) | 931.01 KB |
VS-TV-1140211-04-百崴-RE-SH-Nop-7SL-XR5610(20250205).pdf (898.46 KB) | 898.46 KB |