7SL-XR5610
Intel 4/5th XEON SP 1U Short depth Military Rugged HPC
- Intel® 4/5th XEON® SP Processor Bronze, Silver, Gold
- Up to 2x PCIe Gen5 low profile (two x16 PCIe Gen5)
- 4x 2.5” Swappable SATA SSD up to (RAID 0,1,5,10)
- 4x 25G GbE SFP+, 1x iDRAC Direct (Micro-AB USB 2.0), 1x iDRAC dedicated
- 1x USB 3.0, 1x Serial (Micro-AB USB2.0) port, 1x Mini-Display Port
- MIL-STD-810 Vibration Method 514.6: ◎Acceleration : 5.0 Grms
- MIL-STD-810 Vibration Method 514.6: ◎PSD : 0.01257 g2/Hz
- MIL-STD-810 Shock Method 516.6 : ◎Wave Form: Half Shine Wave
- MIL-STD-810 Shock Method 516.6 : ◎Acceleration: 20G
- MIL-STD-810 Temperature Method 501.5 502.5: ◎ Operating Temp High 55°C
- MIL-STD-810 Temperature Method 501.5 502.5: ◎ Operating Temp Low -30°C
- Technical Profile
- Specifications
- Order Information
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Dell Tier 1 Server maker partnering with 7Starlake
Powered by 7StarLake, Dell takes rugged computing to the next level, delivering OEM servers with unparalleled resilience in vibration, shock, extreme temperatures, and ruggedization. Engineered for unmanned systems, military, defense, AI-enabled applications, and mission-critical industries, Dell’s partnership with 7StarLake ensures hardened reliability, seamless performance, and battlefield-ready durability—empowering edge AI, situational awareness, and autonomous operations in the harshest environments. Mission success starts with Dell’s ruggedized OEM solutions.

- MIL-STD 810 Test
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Random Vibration Test (Operation)
Frequency :5~2000Hz 8.65grms
PSD: 0.0375g²/Hz
Test Axis X,Y,Z (Each axis)
Test Time: 30mins (Each axis)Random Vibration Test (None Operation mode)
Frequency :5~2000Hz 8.75 grms
PSD : 5Hz-15Hz : 0.16g²/Hz
Test Axis X,Y,Z (Each axis)
Test Time: 30mins (Each axis)Shock Test (Operation)
Wave Form Half Sine Wave
Acceleration 40g
Duration. 11ms
Shock Direction +- Z axisShock Test (None Operation mode)
Wave Form Half Sine Wave
Acceleration 75g
Duration. 11ms
Shock Direction +- Z axis
- Product Highlight
-
Technical Specification
5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E)
Up to 16/32 Cores per Processor
Up to 1TB memory with 8 DIMM slots
Storage Internal Controllers: PERC H965i, PERC H965e, PERC H755, PERC H355, HBA355i
(BOSS-N1): HWRAID 1, 2 x M.2 NVMe SSDs
Management and Operating System
Windows®, VMWARE, Ubuntu Server LTS, Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESX
AMI UEFI BIOS type
iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish, iDRAC Service Module, NativeEdge Endpoint Orchestrator
TPM 2.0 support
Expansion
Up to 2 x PCIe 5.0 x 16 Slots
4x 2.5” Swappable SSD, support SATAIII (6Gbps)
Input/Output Versatility
1x Power Button
1x SSD Status LED
2x AC-IN Jack
(Front)
1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0
(Rear)
1 x iDRAC dedicated port, 1 x USB 3.0, 1 x Serial (Micro- AB USB 2.0) port, 1 x Mini-DisplayPort, 1 x RJ45 for dry contact, 4 x 25 GbE SFP+ LOM
Power Supply Options
Redundant 1400 W Platinum 100/240V VAC
1100 W 48V~60V VDC (Optional)
Thermal Solution
Air Cooling 6 x Standard cold swap fans
Environmental
Operating
Temperature: -10°C to 55°C
Humidity: 5%to 95%, non-condensing
Shock: 3 axis, 25g
Vibration: 5Grms
Non-Operating
Temperature: -20°C to 60°C
Humidity: 5%to 95%, non-condensing
MIL-STD-810 Test
Method 500.5, Procedures I and II (Altitude, Operation):
12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)
Method 500.5, Procedures III and IV (Altitude, Non-Operation):
15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
Method 507.5, Procedure II (Temperature & Humidity)
Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating)
Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6, Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Mechanical
Height: 42.8mm
Width: 19 inches (482.6mm)
Depth: 22 inches (566.05mm) with bezel
18.61inches (472.7mm) without bezel
Weight: 25.06 pounds (11.37kg)
- Appearance
System |
|
---|---|
Processor | 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
CPU Core Count | Up to 16 Cores/32 Cores |
Memory Type | DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot |
TPM | Chipset: Infineon, Type: TPM 2.0 |
IPMI | iDRAC RESTful API with Redfish |
BIOS | AMI UEFI BIOS |
USB | 1x USB3.0 +1x USB2.0 ports |
Ethernet | 4x 25G Ethernet SFP+ Ports |
Power Type | 100V~240V AC IN Redundant |
Storage | 4x 2.5” Swappable SATA SAS |
Operating Temp. | -10°C to +55°C |
Dimension | 482mm(W) x 566mm(D) x 42mm(H) |
Front I/O | |
Power Button | 1x |
SSD LED indicator | 1x |
Swappable SSD Tray | 4x |
iDAC | 1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0 |
StorageRear I/O | |
iDAC | 1x iDRAC dedicated Direct port |
USB3.0 | 1x |
Serial | 1x (Micro-AB USB 2.0) |
1G LAN1 | 1x |
10 LAN | 4x |
Display port | 1x Mini-DP |
Environmental | |
MIL-STD-810 Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating) Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
Operating Temp. | -10°C to +55°C |
Storage Temp. | -20°C to +60°C |
Relative Humidity | 5% to 95%, non-condensing |
7SL-XR5610-AC |
7SL-XR5610-DC |
|
CPU |
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
RAM |
DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot |
DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot |
Storage |
4x 2.5” Swappable SATA SAS |
4x 2.5” Swappable SATA SAS |
Power |
1400W 100V~240V AC IN Redundant |
1100W DC 48V~60V |
Thermal |
Active Smart Fan Cooling |
Active Smart Fan Cooling |
Attachment | Size |
---|---|
7SL-XR5610_Performance Test Report.pdf (5.72 MB) | 5.72 MB |
VS-TV-1140211-03百崴-RE-SH-Op-7SL-XR5610(20250205).pdf (931.01 KB) | 931.01 KB |
VS-TV-1140211-04-百崴-RE-SH-Nop-7SL-XR5610(20250205).pdf (898.46 KB) | 898.46 KB |