X7-Pro
GPU & FPGA-Powered Military Laptop | Sensor-to-Decision in One Unit
- Intel® Xeon® D-1848TER (10C/20T) or i7-13800HRE Processor
- NVIDIA Quadro Ada 5000 /A4500
- FMC Slot – FPGA Based Capability
- FHD 1000 Nits Sunlight Readable, Multi-touch Screen
- Dual 10G Fiber Connectivity
- 2 x PoE Ports, Tactical Camera Support
- Swappable NVMe M.2 Storage
- 4 Channel 3G-SDI, Multi-Video Data Input
- Military DTL-38999 Connectors
- IP65/MIL-STD-810/461 for Extreme Temperatures, Shock and Vibration
- Extended Temperature -20°C to +55°C

- Technical Profile
- Specifications
- Order Information
- Video
- Download
- Sensor-to-Decision in One Unit
Designed for mission-critical operations, the 15.6" rugged Military Laptop X7-Pro integrates CPU, GPU, FPGA, 10G fiber and PoE connections into a single portable platform, enabling real-time sensor-to-decision capabilities for RF signal analysis, UAV ground control, and coastal radar systems.
- Advanced CPU, GPU and FPGA Acceleration
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Powered by Intel® Xeon® D Ice Lake or 13th Gen Core™ i7 processors, the X7-Pro is purpose-built to deliver cutting-edge computing performance in the harshest environments, delivering server-grade power in a compact, energy-efficient SWaP-C form factor.
The NVIDIA Ada 5000 GPU provides next-gen AI acceleration and advanced graphics for real-time data analysis, visualization, and decision-making. This enables operators, field engineers, and defense professionals to process massive datasets, render complex 3D environments, and make faster, data-driven decisions on the edge without compromising mobility.
A programmable FPGA card with FMC expansion slots offers unmatched adaptability, enabling rapid integration of custom signal processing and I/O modules.
- 10G Fiber and Dual PoE for High-Speed Connectivity
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Engineered for mobility and rapid deployment, the X7-Pro delivers high-bandwidth, low-latency communication through dual 10G fiber ports, ensuring seamless integration with external sensors. Dual PoE ports provide direct connectivity to tactical cameras, enabling continuous surveillance and live video analysis in the field. A four-channel 3G-SDI interface supports leading EO/IR camera systems, streamlining the transition from image capture to actionable intelligence. With PCIe 4.0 NVMe M.2 storage, the X7-Pro offers exceptional data throughput, built-in redundancy, and secure, instant access to mission-critical information.
- MIL-STD-810/461 and IP65 Ruggedization
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Built to meet MIL-STD-810 for environmental durability and MIL-STD-461 for electromagnetic interference control, the X7-Pro withstands extreme temperatures, shock, vibration, and EMI in demanding operational environments. Its IP65-rated enclosure provides protection against dust, water, and other environmental hazards, while a sunlight-readable multi-touch display ensures uncompromised visibility in outdoor and high-glare conditions. With scalable I/O options, including up to five MIL-DTL-38999 ports for secure, ruggedized connectivity, the X7-Pro seamlessly adapts to land, sea, or airborne missions, delivering consistent performance and reliability wherever the mission leads.
- Appearance
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System |
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CPU |
Intel® Xeon® D-1848TER, 10C/ 20T, 2.0/3.1GHz, 15MB cache, 57W Intel® Core i7-13800HRE, 6P+8E/20T, 2.5/5.0GHz, 24MB cache, 65W |
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| GPU |
NVIDIA® RTX ADA 5000 (9728 CUDA) NVIDIA® QUADRO A4500 (5888 CUDA) |
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Memory |
2 x DDR4, SO-DIMM, up to 64GB 2x DDR5, SO-DIMM, up to 64GB |
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Display |
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Display |
15.6" TFT LCD FHD (1920 x 1080), 1,000 nits brightness display, sunlight readable, resistive multi touch screen Optional: Capacitive multi-touch screen |
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Operating System |
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OS Support |
Windows 10 pro (optional) Windows 11 Pro (optional) |
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Storage |
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Storage |
2 x NVMe M.2 storage |
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Power |
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Power |
230W 100-240VAC, 50/60Hz |
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Dimensions |
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Dimensions |
395 x 375 x 60 mm (15.55 x 14.76 x 3.15 inch) |
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Back I/O (Rugged Connector DTL38999) |
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X1 |
19V DC-IN |
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X2 |
2 x USB2.0 + 8 x GPIO + 2 x RS232/422/485 |
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X3 |
1 x DP |
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X4 |
Optional |
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X5 |
2 x 3G-SDI (Optional) |
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Left I/O |
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Left I/O |
2 x 10G SFP+ (P8 yes; P6 optional) 1 x Audio Combo Jack FMC module (optional) |
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RIGHT I/O |
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Right I/O |
2 x PoE |
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Camera |
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Camera |
1 x 5M webcam |
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Wireless |
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Wi-Fi |
Intel® Wi-Fi 6E AX210 WLAN 802.11 a/b/g/n/ac/ax |
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Bluetooth |
Bluetooth 5.3 Ublox M9N GPS/GLONASS/BeiDou/ Galileo |
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Keyboard |
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Keyboard |
83-key with backlight, resistive |
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Rugged Feature |
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Rugged Feature |
IP65, aluminum-magnesium alloy case, black or green color |
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Environment |
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Operating Temp |
-20°C to +55°C |
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Storage Temp |
-40°C to +71°C |
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Accessories |
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Accessories |
AC adapter: 230W 100-240VAC, 50/60Hz MIL-STD-461 AC adapter (230W, 100-240VAC; optional) |
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MIL-STD-810 Environment Testing Standards |
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Method 501, Operational Temperature, high |
Procedure II: +60°C, two-hour dwell, four cycles |
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Method 501, Storage Temperature, high |
Procedure I: +75°C, two-hour dwell, four cycles |
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Method 502, Operational Temperature, low |
Procedure II: -40°C, two-hour dwell, four cycles |
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Method 502, Storage Temperature, low |
Procedure I: -40°C, two-hour dwell, four cycles |
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Method 514, Vibration |
Category 24/Non-Operating (Category 20 & 24, Vibration) |
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Method 514, Vibration |
Category 20/Operating (Category 20 & 24, Vibration) |
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Method 516, Shock |
Procedure V Non-Operating (Mechanical Shock) |
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Method 516, Shock |
Procedure I Operating (Mechanical Shock) |
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Method 507, Humidity |
Procedure II: exposure to 10 cycles of 95% relative humidity at temperatures of 30 °C to 60 °C with conformal coating (optional) |
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Method 500, Altitude (Low Pressure) |
15,000 feet transport, -200÷2500[m] ground operation and exposed to +55°C and -20°C operation (optional) |
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Method 510, Sand-Dust |
Procedure I: Blasting dust, 12 hours (optional) |
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MIL-STD-461 ELECTROMAGNETIC Testing Standards |
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CE102 |
Conducted emissions, power leads, 10KHz to 10MHz |
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RE102 |
Radiated emissions, electric filed, 30MHz to 5GHz |
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RS103 |
Radiated susceptibility, electric filed, 80Mhz to 3GHz |
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| Attachment | Size |
|---|---|
| 7Starlake_Whitepaper_X7 Military Laptops for Battlefield Operations_20250903.pdf (2.19 MB) | 2.19 MB |