AV800-D27-A45S4

AV800-D27-A45S4 Ice Lake Xeon D-2796NT 20 Core IP65 GPU Server
AV800-D27-A45S4 Xeon D-2796NT 20 Core IP65 Fanless GPU Server
AV800-D27-A45S4 Ice Lake Xeon D-2796NT 20 Core IP65 GPU Server

AV800-D27-A45S4

IP65 Military Xeon D-2796NT,with MXM A4500 GPU Server, 1 x CAN, 4 x COM

  • Designed to meet MIL-810, MIL-461 EMC/EMI
  • Intel® Xeon D-2796NT 20 Cores 
  • 1 x NVIDIA RTX A4500 5888 CUDA Cores
  • 1 x 25GbE SFP28 LAN Port + 1 x RJ45 10 GbE Base-T Port 
  • 2 x RJ45 1GbE Base-T Ports
  • 1 x CAN BUS, 4 x RS232/422/485
  • 1 x M.2 NVMe 2TB Gen4 x4
  • 2 x U.2 NVMe 8TB SSD
  • Extreme Temperature -20°C to 60°C
  • Dimensions: 405 x 316 x 204.8 mm
  • IP65 Sealed with External Cooling Blade
  • MIL-STD-810 Thermal, Shock, Vibration, Humidity
  • Power 18V~36V DC Input

 Special Request :

  • Optional IP66

Intel Partner 7STARLAKE

 

Download
Datasheet
Manual
e-DM
Get A Quote
  • Technical Profile
  • Specifications
  • Order Information
  • Thermal Solution
  • Download

 

MAIN FEATURE
  • Ultra High Performance Intel® Xeon Ice Lake-D, D-2796NT (20xCores)
  • NVIDIA MXM-GPU Quadro RTX4500 5888 CUDA
  • MIL-STD 810 Thermal, Vibration, Shock, Humidity
  • 1x 25GbE SFP28, 1x10GbE, 2x1GbE LAN
  • Up to 512GB LRDIMM /256GB RDIMM
  • 2x NVMe PCIe Gen 4.0 U.2
  • Dual Removable Anti-Drop Solid-State Disk
  • IP65 Sealed with External Cooling Blade
  • MIL-STD-810 Thermal, Shock, Vibration, Humidity
  • MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC)
  • Extreme Temperature Support -20°C~+60°C

U.2

 

INTRODUCTION

satellite

Artificial intelligence (AI) is quickly becoming one of the most crucial elements of business success.  Today, deploying powerful computing platforms that can accelerate and scale their AI-based products and services while adapting them to harsh environments has become vital for many successful military applications.

7Starlake is innovating to address the emerging high-throughput inference market driven by IoT devices which are generating huge amounts of data. The combination of NVIDIA Tensor RT and the new architecture-based GeForce Accelerator is an ideal combination for demanding and latency-sensitive workloads.

​​​​

 

I.    Ultra-High Performance Intel® Xeon® D Processor Ice Lake-D HCC:

圖片5_1.png

Intel® Xeon® processor D-2700 product family offers hardware and software scalability up to sixteen cores, making it the perfect choice for a broad range of high-performing, low-power solutions that will bring intelligence and Intel® Xeon® reliability, availability, and serviceability (RAS) to the edge.

                  

 圖片8_0.png   圖片7_1.png

Enhanced performance per watt:

Intel® Xeon® processor D-2700 product family delivers exceptional value and unmatched performance density per watt. Its TDP of 100W, industry-leading 10 nm process technology and a compute-only design make it ideal for meeting the diverse needs of customers seeking mid-range low-power, high-density solutions.

II.    NVIDIA Quadro RTXA4500 MXM 

SR800-D27 supports 1 x NVIDIA Quadro RTXA4500 MXM Module; can power the planets most reliable mainstream workstations. Designed into a 115-watt package, RTXA4500 is powered by NVIDIA Ampere architecture, supplying innovative multi-precision performance to accelerate a vast range of modern applications. SR800-D27 w/ Quadro RTXA4500 GPU accelerates diverse cloud workloads. These include high-performance computing, data analytics, deep learning training and inference, graphics and machine learning. RTXA4500 MXM features multi-precision Turing Tensor Cores. It comes in a very compact MXM form factor, helping SR800-D27 deliver ground-breaking performance at scale.

A4500

III.    NVMe U.2 Conduction Cooled Pack

A Quantum Leap in Speed : NVMe Gen 4.0x4

In the world of NVMe interface architecture, a direct connection to the CPU is established through the PCIe interface, allowing for efficient memory-like access as data transactions exclusively follow the PCIe bus protocol. The Super High-Performance Gen 4.0x4 NVMe drive stands out with an impressive read/write speed of 7,880MB per second, disrupting the conventional use of hard drives in SATA and SAS. This innovative technology ensures not only a superior bandwidth for data transmission but also guarantees optimal operational efficiency, especially when managing data-intensive tasks crucial for key operations.

Intelligent Passive Cooled solution

With increased speed and performance comes a higher generation of heat which causing higher chance of malfunction. In environments where active cooling is impractical, conventional removable SSD cages struggle to cope with the elevated heat levels, particularly from ultra-high capacity NVMe U.2 SSDs (up to 16TB per pack). Enter the 7StarLake NVMe U.2 Conduction Cooled Pack—a game-changer. Each U.2 SSD is equipped with its own standalone, and anti-corrosive aluminum cooling pack. This innovative solution efficiently redirects heat flow through thermal pads and heatsinks. The distinctive and high-efficiency modular design of the 7StarLake solution distinguishes it from traditional storage alternatives, ensuring exceptional thermal solution even in the face of the intense heat generated by demanding processing tasks.

AV800 Swappable tray

AV800 tray

 

 

Steadfast Against Extreme Pressures

In addition to its outstanding thermal solution, 7StarLake ultra-compact Conduction Cooled Pack features a meticulously designed enclosure specifically tailored to accommodate U.2 SSD dimensions. This meticulous design guarantees that U.2 SSDs remain immune to vibrations and shocks, making them resilient in diverse scenarios such as airborne missions, naval operations, or ground deployments. The precision-engineered enclosure adds an extra layer of protection, ensuring enhanced resilience and improved durability of the U.2 SSDs even in the most demanding and challenging environments.

 

MIL-STD Environment
  • Operating Temperature High: 50°C, MIL-STD-810G, Method 501.5, Procedure I
  • Operating Temp Low: 0°C, MIL-STD-810G, Method 502.5, Procedure I
  • Non-Operating Temperature High: 70°C, MIL-STD-810G, Method 501.5, Procedure II
  • Non-Operating Temperature Low: -40°C, MIL-STD-810G, Method 502.5, Procedure II
  • Operating Altitude: Up to 15,000 ft., MIL-STD-810G, Method 500.5
  • Non-Operating Altitude: Up to 45,000 ft., MIL-STD-810G, Method 500.5
  • Humidity: MIL-STD-810G, Method 507.5, Procedure Ib (Natural Cycle B3)
  • Shock: MIL-STD-810G, Method 516.6, 30 g’s, Saw-tooth, 11ms & MIL-DTL-901E, Grade A, Class II; Type B
  • Vibration: MIL-STD-167, Type I, Deck Mounted Equipment
  • EMI/EMC: MIL-STD-461F, RE101, RE102 (Shipboard Level 1), RS103, CE101, CE102, CS101, CS114, CS116
  • Airborne Noise: MIL-STD-740-1 compliance: 43.7dBA (Idle), 52.5dBA (50%), 54.6dBA (80%)

System

Processor

 Intel® Xeon® D-2796NT, 20core, 40 thread, 30MB Cache, 2.0/3.1GHz. Single socket FCBGA-2579 , up to 120W TDP
Memory type

64GB RDIMM ECC DDR4-3200/2933 MT/s,

Up to 512GB in 4 DIMM Slot

Chipset

 Intel® SoC Integrated

GPU

 1x NVidia® RTX A4500, 5888 CUDA Cores, PCIe Gen4.0 x16

Display

 VGA, Resolution up to 1920x1200@60Hz 32bpp

Chipset

 Aspeed AST2600 BMC
Ethernet Controller

25G SFP28 LAN via SoC

10G LAN via Intel® X550

Gigabit LAN via Intel®i350
LAN 2x 1GBase-T, 1x 10GBase-T Lan, 1x 25GBase SFP
Storage

1x M.2 NVMe 2TB M2. 2280 SSD

2x U.2 NVMe 8TB 2.5” SSD swappable

Power Type

 18V~36V DV Input

Dimension

 405 mm x 316 mm x 204.8 mm (W x L x H)

Front I/O
X1 1x CAN BUS TVS07RF-9-98S connector
X2 1x 10GbE(SFP+) LCFTV70NN connector
X3 1x 10GbE TVSS07RF-11-35SA connector
X4 1x DC-IN TV07RW-13-4P connector
X5 4x RS232/422/485 24FD35SN connector
X6 1x GbE TVS07RF-11-35S-LC connector
X7 1x GbE TVS07RF-11-35S-LC connector
X8 1x USB3.0 USB3FTV7AZNF312 connector
X9 1x VGA D-sub 15 connector with waterproof cap
Environmental
MIL-STD-810 Test

Method 500.5, Procedures I and II (Altitude, Operation):

12,192 M, (40,000 ft) for the initial cabin altitude (18.8 Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9 Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 509.7 Salt Spray (50±5)g/L

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 4,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Reliability

Conduction Cooling.

Designed & Manufactured using ISO 9001 Certified Quality Program
MIL-STD-461

CE102 basic curve, 10 kHz - 30 MHz

RE102-4, (1.5 MHz) -30 MHz - 5 GHz

RS103, 200 MHz - 3.2 GHz, 50 V/m equal for all frequencies

EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-3: 10 V/m, EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

CE and FCC
MIL-STD-1275

Steady State – 20V~33V,

Surge Low – 18V/500ms,

Surge High – 100V/500ms

Emitted spikes

Injected Voltage surges

Emitted voltage surges

Voltage ripple (2V)

Voltage spikes

Starting Operation

Reverse polarity
Operating Temp. -20 to +60°C
Storage Temp. -40 to +85°C
Relative Humidity 5% to 95%, non-condensing
Operating System
Operating System Windows 10 64Bit, Linux by option
RoHS RoHS compliant
order information

Related Products