AV800-D27-CX6
AV800-D27-CX6
IP65 Military Ice Lake D-2796NT, 200G Smart NIC MXM A4500 GPU Server
- Intel® XeoN D-2796NT 20 Cores Turbo 3.10GHz
- 256GB RDIMM ECC DDR4-2933/ 512G LRDIMM DDR4-2933
- NVIDIA RTX A4500 5888 CUDA cores PCIe Gen 4.0 x16
- 2 x100GbE Single-Port QSFP56,Nvidia ConnectX-6
- 2 x 1GBase-T, 2x 10GBase-T LAN
- 2 x 2TB 2.5” Swappable SATA Drive with AES function
- Hardware Secure Erase (AES) button, Swappable CMOS battery
- IP65 Sealed with External Cooling Blade
- MIL-STD-810G Thermal, Shock, Vibration, Humidity
- MIL-STD 18V~36V EMI DC Input
- Extreme Temperature -20°C to 60°C
Special Request :
- Optional IP66

- Technical Profile
- Specifications
- Order Information
- Thermal Solution
- Download
- Introduction
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The AV800-D27-CX6 is a mission-ready, ruggedized AI inference platform engineered for defense and national security deployments operating at the tactical edge. It is built around the Intel® Xeon® Ice Lake D-2796NT processor (20 cores, 2.0 GHz base, up to 3.10 GHz turbo), integrated with an NVIDIA® MXM RTX™ A4500 GPU and NVIDIA® ConnectX®-6 DX SmartNIC delivering up to 200 Gb/s single-port Ethernet connectivity.
Leveraging Intel® Deep Learning Boost, the AV800-D27-CX6 provides server-class AI acceleration in a compact, rugged form factor suitable for harsh and constrained environments. The platform supports real-time AI inference, sensor fusion, and data analytics for deployed defense systems where low latency, high reliability, and autonomous decision support are critical.
Powered by the NVIDIA® RTX™ A4500 (Ampere architecture with 5,888 CUDA cores, 46 RT cores, and 184 Tensor cores), the system delivers exceptional compute density for data-intensive defense workloads, including ISR (Intelligence, Surveillance, and Reconnaissance), situational awareness, autonomous platforms, and advanced signal and image processing at the edge.
The integration of NVIDIA® ConnectX®-6 DX enables ultra-high-bandwidth, low-latency networking with embedded security capabilities. As a SmartNIC, it offloads networking, storage, and security tasks from the CPU, enhancing overall system determinism while supporting secure virtualization, SDN/NFV, and encrypted data transport—key requirements for modern defense networks.
With its combination of rugged design, high-performance AI inference, and secure high-speed connectivity, the AV800-D27-CX6 is an ideal HPC edge platform for defense applications requiring resilient compute, real-time intelligence processing, and secure data handling in contested or remote operational environments.
- Ultra-High Edge Performance
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Intel® Xeon® D Processor Ice Lake-D HCC
The Intel® Xeon® D-2700 processor family delivers scalable compute performance with support for up to sixteen cores, making it an ideal foundation for high-performance, low-power edge solutions. It extends Intel® Xeon®–class reliability, availability, and serviceability (RAS) to edge deployments, enabling intelligent processing with enterprise-grade dependability.
Designed for performance efficiency, the Intel® Xeon® D-2700 processors provide exceptional performance density per watt. With a 100 W TDP, advanced 10 nm process technology, and a compute-optimized architecture, the platform is well suited for mid-range, high-density applications where power efficiency, scalability, and consistent performance are critical.

NVIDIA Quadro RTX A4500 MXM
The AV800-D27-CX6 supports a single NVIDIA® RTX™ A4500 MXM module, delivering workstation-class GPU performance within a compact and rugged platform. Operating within a 115-watt power envelope and based on NVIDIA’s Ampere architecture, the RTX™ A4500 provides advanced multi-precision compute capabilities to accelerate demanding workloads such as high-performance computing, data analytics, deep learning training and inference, machine learning, and advanced graphics. Its compact MXM form factor and high-efficiency Tensor Cores enable exceptional performance density, allowing the AV800-D27-CX6 to deliver scalable, high-end acceleration in space- and power-constrained edge environments.

NVMe U.2 Conduction Cooled Pack
A Quantum Leap in Speed: NVMe Gen 4.0x4
In NVMe interface architecture, storage devices connect directly to the CPU via the PCIe bus, enabling low-latency, memory-like access by eliminating legacy storage protocol overhead. The Super High-Performance PCIe Gen 4.0 x4 NVMe drive delivers exceptional throughput of up to 7,880 MB/s read/write, far surpassing traditional SATA and SAS storage solutions. This advanced architecture provides significantly higher bandwidth and improved efficiency, making it ideally suited for data-intensive workloads and mission-critical operations that demand fast, reliable access to large volumes of data.
- Block Diagram
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- Ultra High Performance Intel® Xeon Ice Lake-D, D-2796NT (20xCores)
- NVIDIA MXM-GPU Quadro RTX A4500 5888 CUDA
- 2x 25GbE SFP28, 2x10GbE
- Up to 512GB LRDIMM /256GB RDIMM
- 2x NVMe PCIe Gen 4.0 U.2
- Dual Removable Anti-Drop Solid-State Disk
- Hardware Secure Erase (AES) by option
- IP65 Sealed with External Cooling Blade
- MIL-STD-810 Thermal, Shock, Vibration, Humidity
- MIL-STD 461 EMI/EMC 18V~36V DC-IN (28VDC)
- Extreme Temperature Support -20°C~+60°C

- MIL-STD Environment
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- Operating Temperature High: 50°C, MIL-STD-810G, Method 501.5, Procedure I
- Operating Temp Low: 0°C, MIL-STD-810G, Method 502.5, Procedure I
- Non-Operating Temperature High: 70°C, MIL-STD-810G, Method 501.5, Procedure II
- Non-Operating Temperature Low: -40°C, MIL-STD-810G, Method 502.5, Procedure II
- Operating Altitude: Up to 15,000 ft., MIL-STD-810G, Method 500.5
- Non-Operating Altitude: Up to 45,000 ft., MIL-STD-810G, Method 500.5
- Humidity: MIL-STD-810G, Method 507.5, Procedure Ib (Natural Cycle B3)
- Shock: MIL-STD-810G, Method 516.6, 30 g’s, Saw-tooth, 11ms & MIL-DTL-901E, Grade A, Class II; Type B
- Vibration: MIL-STD-167, Type I, Deck Mounted Equipment
- EMI/EMC: MIL-STD-461F, RE101, RE102 (Shipboard Level 1), RS103, CE101, CE102, CS101, CS114, CS116
- Airborne Noise: MIL-STD-740-1 compliance: 43.7dBA (Idle), 52.5dBA (50%), 54.6dBA (80%)
- NVIDIA CONNECTX-6 DX
NVIDIA® ConnectX®-6 DX is a highly secure and advanced smart network interface card (SmartNIC) that accelerates mission-critical cloud and data center applications, including security, virtualization, SDN/NFV, big data, machine learning, and storage. ConnectX-6 DX provides up to two ports of 100Gb/s or a single port of 200Gb/s Ethernet connectivity and is powered by 50Gb/s (PAM4) or 25/10 Gb/s (NRZ) SerDes technology. ConnectX-6 DX features virtual switch (vSwitch) and virtual router (vRouter) hardware accelerations delivering orders-of-magnitude higher performance than softwarebased solutions. ConnectX-6 DX supports a choice of single-root I/O virtualization (SR-IOV) and VirtIO in hardware, enabling customers to best address their application needs. By offloading cloud networking workloads, ConnectX-6 DX frees up CPU cores for business applications while reducing total cost-of-ownership.
PRODUCT SPECIFICATIONS Maximum total bandwidth 200Gb/s Supported Ethernet speeds 10/25/40/50/100/ 200GbE Number of network ports 1/2 Network interface technologies NRZ/PAM4 Host interface PCIe Gen4.0 x16, with NVIDIA Multi-Host™ technology DPDK message rate Up to 215Mpps Platform security Hardware root-oftrust and secure firmware update Form factors PCIe HHHL, OCP2, OCP3.0 SFF Network interfaces SFP+, QSFP+, DSFP
- Appearance
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- Dimensions

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System |
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Processor |
Intel® Xeon® ICELAKE-D D-2796NT Processor, 20Cores, 40Threads, Base Frequency 2.0GHz |
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Memory type |
256GB RDIMM ECC DDR4-2933 / 512G LRDIMM DDR4-2933 in 4 DIMM Slot |
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GPU |
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Graphics Card |
NVidia® RTX A4500 5888 CUDA Cores PCIe Gen4.0 x16 |
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Storage |
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HDD/SDD |
2x NVMe PCIe GEN 4.0 x 4 Hardware Secure Erase (AES) by option |
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Front I/O |
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X1 |
DC In connector |
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X2 |
1x USB3.0 Amphenol USB3FTV7AZNF312 connector |
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X3 |
1x 1GBase-T TV07RW-13-98S connector |
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X4 |
1x 1GBase-T TV07RW-13-98S connector |
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X5 |
1x 10GBase-T M20 RJ45 CAT6A connector |
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X6 |
1x 10GBase-T M20 RJ45 CAT6A connector |
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X7 |
2x 100G Fiber Ethernet Amphenol FSI MPOFTV70ZNN |
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| VGA | D-sub 15 connector with waterproof cap | |
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Side I/O |
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SSD tray |
2x Dual 2.5" HDD/SSD Easy Swap Tray |
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Power Button |
1x Power Button with LED backlight |
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Power Requirement |
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Power Input |
MIL-STD-461 EMI power supply, 18V~36V DC-IN (300W) |
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| Applications | ||
| Applications | Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions. | |
| Operating System | ||
| Operating System | Windows 10 64Bit, Linux by request. | |
| Physical | ||
| Dimension | 405mm x 316mm x 195mm (W x L x H) | |
| Weight | 10KGS | |
| Chassis | Aluminum Alloy, Corrosion Resistant | |
| Finish | Anodic aluminum oxide (Color Iron gray) | |
| Cooling | Intelligent Active Cooled | |
| Environmental | ||
| MIL-STD-810G Test |
Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
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| Reliability |
Conduction Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program. |
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| MIL-STD-461 |
CE102 basic curve, 10kHz - 30 MHz RE102-4, (1.5 MHz) -30 MHz - 5 GHz RS103, 200 MHz - 3.2 GHz, 50 V/m equal for all frequencies EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV CE and FCC |
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| MIL-STD-1275 |
Steady State – 20V~33V, Surge Low – 18V/500ms, Surge High – 100V/500ms Emitted spikes Injected Voltage surges Emitted voltage surges Voltage ripple (2V) Voltage spikes Starting Operation Reverse polarity |
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| Operating Temp. | -20°C to +60°C | |
| Storage Temp. | -40°C to +85°C | |
| Relative Humidity | 5% to 95%, non-condensing. | |
AV800-D27-CX6
Military MXM-GPU System GPGPU AI Inference Computer with Intel® Xeon® D-2796NT Processor, NVIDIA MXM A4500, 2 x100GbE Single-Port QSFP56,Nvidia ConnectX-6, 2x2.5" SATA (w/i H/W AES) , MIL-STD D38999 Connectors, 18V~36V DC-in, Operating Temperature -20~+60 °C
AV800-D27-A45
Military MXM-GPU System GPGPU AI Inference Computer with Intel® Xeon® D-2796NT Processor, NVIDIA MXM A4500, 2x2.5" SATA , MIL-STD D38999 Connectors, 18V~36V DC-in, Operating Temperature -20~+60 °C
AV800-D27-A50
Military MXM-GPU System GPGPU AI Inference Computer with Intel® Xeon® D-2796NT Processor, NVIDIA MXM Ada 5000, 2x2.5" SATA , MIL-STD D38999 Connectors, 18V~36V DC-in, Operating Temperature -20~+60 °C
| Attachment | Size |
|---|---|
| AV800-D27 System test report _20240321.pdf (2.92 MB) | 2.92 MB |
| AV800-D27 10G Ethernet Test Report.pdf (2.43 MB) | 2.43 MB |
| AV800-D27-A50 Outgoing Quality Inspection Report.pdf (3.42 MB) | 3.42 MB |
| AV800-D27-A50 RE102_CE102.pdf (1.69 MB) | 1.69 MB |